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- MEMS封装中真空封口及真空度检测技术Study of vacuum packaging and vacuum level testing technologies of MEMS packaging
- 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.
- MEMS封装MEMS package
- 模块式MEMS封装MOMEMS
- MEMS封装技术及标准工艺研究Study on MEMS Packaging Technology and Its Standard Process
- MEMS封装用氮化铝共烧基板研究The Study of Aluminum Nitride Co-fire Ceramic Substrate for MEMS Package
- MEMS真空封装MEMS vacuum package
- MEMSmicro-electro-mechanical systems
- TCP封装TCPencapsulation
- TO封装TO packaging
- 3D-MEMS3DX-MEMS
- 铝封装aluminum encapsulation
- MEMS技术MEMS technology
- 封装变化Find what varies and encapsulate it
- MEMS陀螺MEMS gyroscope
- UDP封装UDP encapsulation
- MEMS器件MEMS device
- IC封装IC package
- 柔性MEMSflexible MEMS
- 封装胶encapsulation
