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- 模块式MEMS封装MOMEMS
- 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.
- 扭转臂杠杆式MEMS膜开关的分析Analysis for MEMS membrane switch using torsion spring and leverage
- 模块module
- MEMS封装中真空封口及真空度检测技术Study of vacuum packaging and vacuum level testing technologies of MEMS packaging
- 电容式MEMS开关capacitive MEMS switch
- 模块式PL/1程序modular PL/1 program
- 折叠弹簧式MEMS水平扭转微镜的设计与分析Design and analysis of a MEMS horizontal torsion micro mirror with folded springs
- MEMS封装MEMS package
- 嵌入式flush bonding
- MEMS封装技术及标准工艺研究Study on MEMS Packaging Technology and Its Standard Process
- 模块化modularize
- MEMS封装用氮化铝共烧基板研究The Study of Aluminum Nitride Co-fire Ceramic Substrate for MEMS Package
- 间接加热式MEMS微波功率传感器的模拟与设计Simulation and Study on Indirectly-heated MEMS Microwave Power Sensor
- 过去式preterite
- 功能模块functional module
- 间接加热终端式MEMS微波功率传感器的温度模拟Thermal Simulation of the Indirectly-Heated Terminating Type MEMS Microwave Power Sensor
- 电源模块power module
- 式的fashioned
- 移动式mobile
