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- MEMS真空封装MEMS vacuum package
- 焊料键合实现MEMS真空封装的模拟Simulation of Vacuum Package for MEMS Devices with Solder Bonding
- MEMS器件真空封装内部真空度测试的研究Research of Vacuum Measurement of Vacuum Packaged MEMS Devices
- 真空vacuum
- 真空封装的硅微陀螺仪Vacuum packaged silicon micromachined gyroscope
- 真空封装vacuum encapsulation
- 真空封装罐头vacuum packed can
- 真空包装vacuum packing
- 抽真空vacuumize
- MEMSmicro-electro-mechanical systems
- 圆片级真空封装wafer-level vacuum package
- TCP封装TCPencapsulation
- 真空度vacuity
- TO封装TO packaging
- 真空的vacuum
- MEMS器件设计、封装工艺及应用研究Research on MEMS Device Design, Packaging Process and Application
- 传感芯片真空封装的质谱检测Mass Spectrometry Analysis for Vacuum Packaged Sensor Chip
- 真空吸尘器vacuum cleaner
- 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.
- 真空断路器vacuum circuit breaker
