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- Development of Compound Semiconductor Wafer and Device Bonding 化合物半导体晶片和器件键合技术进展
- compound semiconductor wafer 化合物半导体晶片
- Kern, W., 1993, Handbook of Semiconductor Wafer Cleaning Technology, Noyes, U.S.A. 张俊彦、郑晃忠，1997，积体电路制程及设备技术手册，经济部技术处，台湾。
- Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips. 这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。
- The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition. 该半导体晶片上形成的一层互连膜与绝缘膜的可靠性可以在加速条件下加以评估。
- Wein, L. M. "Scheduling Semiconductor Wafer Fabrication." IEEE Transactions on Semiconductor Manufacturing 1, no. 3 (August 1988). 着，“半导体晶圆制造排程”半导体制造IEEE会刊第1卷第3号（1988年八月）
- Wein, L. M. "On the Relationship Between Yield and Cycle Time in Semiconductor Wafer Fabrication." IEEE Transaction on Semiconductor Manufacturing 5, no. 2 (May 1992). 着，“半导体晶圆制造良率与制程时间的关连性”半导体制造IEEE会刊第5卷第2号（1992年五月）
- Zinc oxide is a II-VI wide band-gap (3.3eV) compound semiconductor with wurtzitecrystal structure. 氧化锌(ZnO)是一种具有六方结构的II-VI族宽带隙半导体材料;室温下带隙宽度高达3.;3 eV。
- According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed. 针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
- To solve rescheduling problem for semiconductor wafer fabs effectively,a swarmintelligence-based complete modification rescheduling method was proposed. 基于群体智能思想,提出了全局修正式半导体生产线重调度方法。
- C. T. Su, T. Yang and C. M. Ke, “A neural-network approach for semiconductor wafer post-sawing inspection,” IEEE Trans. on Semicond. Manuf., vol. 15, no 2, pp. 260-266, 2002. 蔡英男，应用影像处理与类神经网路于偏光膜瑕疵检测，国立台湾科技大学高分子所硕士论文，2003。
- Riber is a world leading supplier of MBE (Molecular Beam Epitaxy) products and services to the compound semiconductor community. 瑞博是一个制造分子束外延设备的公司，其设备在化合物半导体领域处于领先地位。
- GUAN Zi-qiang.Design principles and maintenance of four-pin-probe electrodynamic instrument for semiconductor wafer evaluation[J].Southern Metals,2003(1):55-58. [3]关自强.;四探针电动测试仪设计原理及维修[J]
- Comparing to conventional NDR device, the resonant-tunneling-diode (RTD) device is fabricated by the technique of compound semiconductor. 与传统的负微分电阻元件相比 较，共振穿透二极体是经由化合物半导体的技术来制作。
- To solve rescheduling problem for semiconductor wafer fabs effectively, a swarm-intelligence-based complete modification rescheduling method was proposed. 基于群体智能思想，提出了全局修正式半导体生产线重调度方法。
- In this dissertation, we studied the growth of Sb-containing compound semiconductor materials and devices by using solid source molecular beam epitaxy (SSMBE). 摘要:本篇论文中研究以固态源分子束磊晶法成长含锑化合物半导体材料与元件。
- For the first time, a standard CMOS technology can offer gain, bandwidth, and power performances comparable to advanced compound semiconductor technologies (SiGe, GaAs, InP). 第一次利用CMOS技术所设计的宽频放大器可达到增益、频宽、输出功率可以与高阶的化合物半导体技术（矽化锗、砷化镓、磷化铟）。
- A hole formed by etching through an oxide or insulating layer on a semiconductor wafer for the purpose of permitting diffusion into or deposition onto aselected area of the semiconductor. 为了在半导体中选定的区域内扩散或沉积，在半导体圆片蚀刻氧化层或隔离层形成的孔。
- The Company: South Epitaxy Corporation (SEC) founded in March 2000, is dedicated to be the best compound semiconductor epi-wafer manufacturer in the world. 公司：元砷光电科技股份有限公司（SEC）成立于2000年3月，立志成为全世界最优秀的化合物半导体磊晶片制造商。
- Application: Sulphuric acid, fertilizer, papermaking, dynamite and rubber. It is also used for the manufacture of II-VI compound semiconductor, photoelectric devices and etc. 主要用途:硫酸，化肥，造纸，炸药和橡胶。也用于生产II-VI半导体，光电装置等。
