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- Electronic manufacturing consistof semiconductor manufactruing, electronic packaging and assembling. 电子制造包括半导体制造和电子封装与组装。
- The CPC electronic packaging materials have the best integrated properties when annealed under the temperat. 研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
- A fabricating technology for high energy density micro electromagnetic actuator based on Micro Electron Mechanics System(MEMS) is introduced. 提出了制作高能量密度电磁驱动器的工艺方法。
- TIANJIN SHUANGLU ELECTRONICS PACKAGING MATERIAL CO., LTD. 天津市双鹿电子元件包装材料有限责任公司。
- Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year. 由中国电子学会生产技术学分会(CEPS)主办的电子封装技术国际会议(ICEPT)将迎来第十届庆典。
- A new experimental technique on the CTE measurement of metal composite leads in electronic packaging using laser speckle interferometry was presented. 在相对简单的实验设备下,得到较高精度金属复合引线的热膨胀系数值。
- FM2822 is a dimmable electronic ballast ASIC of SHANGHAI FUDAN Micro electronics Corporation. FM2822是上海复旦微电子公司推出的一款可调光电子镇流器ASIC。
- This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering. 这个版本还包括涵盖新课题，如纳米技术，微机电系统，电子封装，全球气候变化，电动和混合动力汽车，生物工程。
- The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在电子元件的设计和电子封装的可靠性评估中焊点的热-机械可靠性是一个关键的因素。
- The Fuzhou auspicious core micro electron limited company is aspecialized integrated circuit design company, and recognizes in2005 after the national examination and approval for the integrated circuitdesign enterprise. [项目概况]福州瑞芯微电子有限公司是一家专业的集成电路设计公司，并于2005年经国家审批认定为集成电路设计企业。
- It describes the current situation of electronic packaging industry, analyzes the waste in its inner management, shows the detail steps of using 5S activity in the test workshop. 摘要从电子封装企业的生产现状出发，针对企业内部管理存在的问题，提出在测试车间推行"5S"管理活动的具体实施步骤。
- Waxes for Electron Wafer Binding: Waxes for Electron Wafer Binding,mainly used in precision process of micro electron wafer (U piece,S piece or SMD piece),excellent strong adhesive ability,no scathe to element ,cleanup easily after process. 电子晶片粘接蜡系列：主要用于微电子硅片或石英晶片（U片、S片或SMD片）的精密加工，具有极强的附着力，对元件无任何损伤，使用后易去除。
- IAM GmbH is a company operating within many ranges and offers Development projects, Micro electronics as well as Research projects. 是一家诚信的、高效能的生产商和服务商，该公司提供新型的、专门的产品，例如科研项目,技术转化、技术引进。
- In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with13 refs. 结合电子封装的现状、子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、磷三官能团型、机硅多官能团脂环族环氧树脂。
- In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs. 摘要结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求，介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景，其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。
- The thermal analysis of MCM in the past is less likely to adopt Non-Fourier model. The analysis course and method in this paper may be used to study the Non-Fourier effect in electronic packaging for reference. 以往多芯片组件的热分析较少采用Non-Fourier导热模型进行分析,本文所采用的分析过程和方法,对电子封装中的Non-Fourier效应问题的研究提供了可借鉴的分析方法。
- micro electronic mechanical system 微电子机械系统
- The method of polypyrrole (PPy) films being synthesized on the surface of insulating epoxy molding compound (EMC) electronic packaging materials and the shielding effectiveness of PPy film were studied. 研究了将导电聚吡咯(PPy)薄膜制备在绝缘环氧模塑料(EMC)电子封装材料表面的方法,及导电PPy 薄膜的电磁屏蔽效能。
- Micro electronic mechanical system(MEMS) gyroscope 微机电陀螺
- Raytheon will furnish systems engineering, information assurance, maritime C4I hardware and electronics packaging, and integrated logistics support. 雷声公司将提供系统工程、信息担保、海上C4I硬件和电子包，以及综合后勤支撑。
