The thermal analysis of MCM in the past is less likely to adopt Non-Fourier model. The analysis course and method in this paper may be used to study the Non-Fourier effect in electronic packaging for reference.

• 以往多芯片组件的热分析较少采用Non-Fourier导热模型进行分析,本文所采用的分析过程和方法,对电子封装中的Non-Fourier效应问题的研究提供了可借鉴的分析方法。