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- Chemical Mechanical Polishing (CMP) is the most effective way to achieve global planarization in semiconductor process. 化学机械抛光，是半导体制程中达到全域平坦化最有效的办法，同时也是众多制程中不可或缺的重要制程步骤。
- Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. 摘要:化学机械抛光是现在半导体产业中最常被使用的平坦化制程。
- Diamond disk conditioners have long served the semiconductor chemical mechanical polishing (CMP) process for polish pad dressing. 摘要钻石修整器应用于化学机械抛光中抛光垫的修整，已有很长的一段时间。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. 化学机械抛光，是目前半导体制程中达全域平坦化最有效的方式，同时也是许多制程中不可缺少的步骤。
- Boning, D., W. Moyne and T. Smith, “Run by Run Control of Chemical Mechanical Polishing,” IEEE Trans. CPMT (C), 19, 307-314 (1996). 周育乐，考虑制程使用时间之批次控制方法，台湾大学工业工程研究所硕士论文，台北，台湾(2000)。
- G. Corlett, “Targeting Water Use for Chemical Mechanical Polishing,” Solid State Technology, Vol. 43, No. 6, pp. 201-206 (2000). 蔡明莳，“化学机械研磨后清洗技术简介”，奈米通讯，第6卷，第1期，第21-27页（1999）。
- Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates. 硬盘盘基片粗抛光必须在较高材料去除率的基础上获得高表面质量。
- With compensation-oriented chemical mechanical polishing (CMP) as the carrier, the study elucidates the procedures of this method for the innovative research and development case. 以补偿式化学机械抛光为载具，作为进行创新研发之案例来阐述本方法之流程步骤。
- Chemical mechanical polishing (CMP) technology has been considered as the most effective local and global planarization technology for wafer and widely used in ULSI fabrication. 化学机械抛光(CMP)是目前唯一能够实现硅片局部和全局平坦化的实用技术和核心技术，正广泛地应用于IC制造中。
- Slurry flow weighs heavily on the performances of chemical mechanical polishing(CMP) process,wherein the pad surface will alter the flow features considerably. 抛光垫表面特性能可大大改变抛光液的流动情况,从而影响化学机械抛光的抛光性能。
- This feature can be eliminated via mechanical polishing and followed by chemical etching, and hence only exciton line was observed for the damage-removed sample. 此篇论文中所有的化合物半导体单晶样品，在做光学量测之前，皆有经过机械磨光以及化学蚀刻的处理。
- Investment casting with stainless steel, carbon steel, alloy steel and heat treatment. Machining with CNC mirror polishing, mechanical polishing, electro polishing, parts assembly. And products of steel fabrication. 不锈钢、碳钢、合金钢的精密铸造、铸件的热处理、CNC机械加工、镜面抛光、机械抛光、电解抛光、部件装配及钢结构件的生产。
- A set of conventional processing methods of vanadium and vanadium alloy specimens, including mechanical polishing, mechanical chemical polishing, chemical etching as well as relevant techniques and experiences is introduced. 摘要介绍了一种钒及钒基合金金相试样的常规制样方法，即试样的机械磨光，机械化学抛光，化学侵蚀等技术和经验。
- By considering the effect of the soft layer and the deformation of the abrasive particles on the material removal in chemical mechanical polishing(CMP),the solid-solid contact mode of CMP was modified. 通过分析软质层的形成、作用以及纳米磨料的自身变形对材料去除的影响,改进了CMP过程的接触力学模型;
- This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers.The emphasis is on Chemical Mechanical Polishing (CMP). 报告研究了半导体层的抛光技术，技术的发展趋势以及产品，产品应用，并介绍了材料和设备供应商。
- A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested. 介绍餐具光亮镀银的全套实用工艺，包括化学抛光、机械抛光、除蜡、除油、镀镍、镀银、以及镀后处理等。
- The processing method is used for flattening the surface of the substrate of the film circuit, thus avoiding mechanical polishing which is complicated in process, and significantly reducing the cost. 本发明用于薄膜电路基片表面的平坦化处理，可以避免工艺复杂的机械抛光，从而大幅度降低成本。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry.The polishing pad is one of the primary consumables in CMP. 摘要:化学机械抛光，是目前半导体制程中达全域平坦化最有效的方式，同时也是许多制程中不可缺少的步骤。
- Give the table a good rub with this polish. 用这上光剂把桌子好好擦一擦。
- Chemical Mechanical Polishing of Sapphire Substrate 蓝宝石衬底片化学机械抛光的研究
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