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- liquid encapsulation method 液体覆盖方法
- This encapsulation method was introduced with Microsoft Exchange Server version 5.5. 此封装方法在Microsoft Exchange Ser verversion 5.;5中引入。
- liquid encapsulation Czochralski method 液封直拉法
- high-pressure liquid encapsulation pulling method 高压液封直拉法
- With dimethyldiethoxysilane (DMDES) as silicon donor, an encapsulation method is used to fabricate the inner-Si-doped polystyrene capsules. 以二甲基二乙氧基硅烷为原料,利用乳液微封装技术和介面聚合技术可以实现单一内表面掺硅的空心聚苯乙烯微球的制备。
- The authors establish the physical and mathomatical model of the Marangoni convection in liquid bridge with liquid encapsulation (or two immiscible coaxial liquid columns). 本文建立了具有液封的液桥(不相溶混的双层同轴液柱)内热毛细对流的物理模型和数学模型。
- Currently, Exchange 2007 doesn't support messages that are encoded with the IMCEA encapsulation method when the name part of the address exceeds 315 characters. 目前,如果地址的名称部分超过315个字符,Exchange 2007不支持使用IMCEA封装方法编码的邮件。
- The recombination-type semi-insulating gallium arsenide material of high resistivity is prepared by B2O3 liquid encapsulated Czochralski method (LEC). 采用B_2O_3液封直拉法制备出高电阻率的复合型半绝缘砷化镓。
- Which encapsulation methods are most commonly used with dialup integrated services Digital Network (ISDN)? 在一线通中一般使用哪两种数据封装方式?
- Exchange 2007 supports encapsulated addresses that use the Internet Mail Connector Encapsulated Address (IMCEA) encapsulation method. Exchange 2007支持使用Internet邮件连接器封装地址(IMCEA)封装方法封装的地址。
- liquid encapsulation czochralski process 液封直拉法
- liquid bridge with liquid encapsulation 液封液桥
- Most synthetic detergents are in the form of powder or liquid. 大多数合成洗涤剂呈粉状或液态。
- The invention relates to an encapsulating method for metal flat plate type semiconductor, which is mainly used for four-face footless flat patch-typed encapsulating of semiconductors. 本发明涉及一种金属平板式半导体封装方法,主要用于半导体的四面无脚扁平贴片式封装。
- Be careful not to lose too much liquid by evaporation. 小心,不要因为蒸发作用而失掉过多的水份。
- The invention relates to a novel encapsulating method for metal flat plate type novel semiconductor, which is mainly used for four-face footless flat patch-typed encapsulating of semiconductors. 本发明涉及一种金属平板式新型半导体封装方法,主要用于半导体的四面无脚扁平贴片式封装。
- Thc principlcs and characteristics of thesc methods, such as solid-phase, liquid-phase .gas-phase and zeolite encapsulating method, are also described. 论述了固相法、液相法、气相法和沸石包容法的原理及其特点;
- The surface of the liquid gradually crusted over. 液体表面渐渐地结了一层皮。
- The invention relates to a novel encapsulating method for groove metal plate type semiconductors, which is mainly used for four-face footless flat patch-typed encapsulating of semiconductors. 本发明涉及一种凹槽金属板式新型半导体封装方法,主要用于半导体的四面无脚扁平贴片式封装。
- The dregs settled and the liquid became clear. 渣滓沉淀下来,液体变清了。
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- 深远海浮式风电平台 - deep-sea floating wind power platform
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