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- Navin Bhandarkar,Lim Thiam Beng,1996,”Low-Stress Leadfram Design for Plastic IC Package ”, IEEE Electronic Component and Technology Conference, pp.803-807. 黄俊琦,2003年,”薄型电子构装晶片应力分析与晶片可靠性设计研究”,国立云林科技大学机械工程所硕士论文。
- In the IC packaging and testing has seen a typical phenomenon, a roaming from start to finish, not used by ordinary attacks, all the skills to use. 在封测曾经见到过一个典型现象,一个漫游从开始到结束,没用过普通攻击,全是用的技能。
- Focus on the stability of sub-industries performance, the IC design industry has minimum volatility, secondary is lead-frame, photomask and IC packaging and testing industries. 四、子产业绩效表现之稳定性,以IC设计业的波动最小,其次为导线架业、光罩业及IC封装测试业;
- Amkor Technology try to be the leading innovator in the IC packaging and test industry supporting the most successful semiconductor companies in the world. 公司致力于IC封装测试业的领先者和创新者,支持世界上大多数成功的半导体企业。
- High Frequency IC Package Design Based on QFP Lead Frame 基于QFP技术的高频集成电路封装设计
- The Development of High Quality CCL for HDI and IC Package HDI和IC封装用高性能覆铜板的开发
- Chien, C.H., Weng, D.J., Chiou, Y.T., Tsai, M.L. and Chen, Y.C., 2002, "The Effect of Moisture on the Interfacial Adhesion of IC Packages," International Symposium on Experimental Mechanics, Taipei, Taiwan, pp. 1-6. 钱志回、谢其昌、陈永昌、吴以德、周业兴、杨世豪、蔡宗宪、许呈宇,2002,?接合填充胶/防焊漆/基板经温度循环黏著强度之研究?,第二十六届全国力学会议,云林,第1-11页。
- This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems. 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
- Flip Chip (FC) technology, which is widely used in IC packaging, is introduced into the fabrication of three-dimensional packaged integrated power electronics module ( IPEM ) to construct Flip Chip IPEM (FC- IPEM). 倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。
- It discusses not only a kind of new Vacuum Jointing Process in IC Packaging but also its theory and background. Besides, it enumerates the remarkable achievements by implementing this process. 摘要论述了在集成电路生产中一种新的真空烧结工艺,讨论了它的理论依据及产生背景,并列举了通过实行该工艺所带来的显著成绩。
- The gay package is only for dandy. 这种鲜艳的包装只是为了美观。
- The goods are to be sent in airtight package. 这批货物应密封包装运送。
- The Voice Coil Motor (VCM),which characterized as small inertia,high frequency response and fast convergence, is widely applied in high precision motion control in IC Packaging device. 音圈电机是一种广泛应用于IC装备的高精度驱动元件,具有小惯量,高频响,以及收敛快的控制特性。
- My aunt is hooked on package holidays in Spain. 我的姑母着迷于旅行社包办的西班牙度假。
- The package carries no written message. 包裹内不得夹带书信。
- Oxidation Failure and Mechanism of Lead Frame Copper Alloys for IC Package IC铜合金引线框架材料的氧化失效及其机理
- The proposal was presented as final package deal. 那项建议是作为最终的一揽子交易提出来的。
- He tied the package with a cord. 他用绳子把包裹扎紧。
- Can you deliver a large package of books? 你能把一大包书寄出去吗?
- We tied up both package well with heavy cord. 我们用粗绳把所有包裹捆扎妥当。
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