This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
英
美
- 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
- 今日热词
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- 深远海浮式风电平台 - deep-sea floating wind power platform
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- 京雄高速公路 - Beijing-Xiongan expressway
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- 农业及相关产业增加值 - the added value of agriculture and related industries