flip-chip bump

 
  • 凸焊点

flip-chip bump的用法和样例:

例句

  1. Some typical applications in under bump metallurgy(UBM)for flip chip bumping,PC boards,LCRs and computer hard disk are reviewed.
    指出,减少污染、延长镀液使用寿命、降低成本仍然是化学镀镍面临的一项长期的任务;
  2. flip chip bump
    倒装芯片隆起焊盘
  3. The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
    一种低成本倒装芯片用印刷凸焊点技术的研究
  4. The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).
    钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
  5. Flip Chip technology is a typical application.
    倒装芯片技术就是其中一个典型应用。
  6. Bump Fabrication Methods for Flip Chip
    倒装芯片凸点制作方法

flip-chip bump的相关资料:

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