die bonding process

 
  • 键合工艺

die bonding process的用法和样例:

例句

  1. In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding.
    目前除了需要不断提高键合机硬件性能外,开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。

die bonding process的相关资料:

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