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- chip bonding pad 芯片焊盘
- The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface. 采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。
- To avoid this problem, the effective bonding pad sizes and spacing must be reduced. 为了避免这个问题,有效的键合压脚尺寸和间距都必须减少。
- Jeon I and Chung Q,“The study on failure mechanisms of bond pad metal peeling: Part A-Experimental investigation. 张恒硕;“电子构装金线接点破坏机构及显微组织分析;”国立中山大学材料科学研究所博士论文;2002.
- High viscosity, thixotropic paste for wire tacking, chip bonding and coil terminating. 高粘性,触变膏体,用于导线定位、片结合、线圈终端。
- LTD,the new type of bonding pad roll with complex curve roller contour is design,it avoid point and arc touching between the bevel edge of outside welding and roller sur. 根据宝鸡石油钢管有限责任公司承揽的印度“东气西输管线”钢管生产工艺要求,设计了一种复合曲线辊型的焊垫辊。
- The failure mechanism of lifted bond pad was analyzed through chemical decapsulation and SEM/EDX technologies in this paper. 其中,一种发生频率高的失效模式是金球在键合点的脱落。
- Because of the baking in the oven, the epoxy built out EBO to influence the bond pad and induced bond pad contamination by EBO. 由于需在烤箱中烘烤,造成银胶熏胶或胶油扩散去影响焊垫因而导致焊垫污染脏污。
- In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM. 另外,由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着MCM中倒装焊接技术的普及应用,本文还对三种支撑技术进行了研究。
- Surface Mounting and Chip Bonding Technology 表面组装与芯片键合混合工艺浅探
- MCM Flip Chip Bonding Technology Research MCM中倒装焊接技术研究
- He is a great guy, a chip off the old block. 他是一位好人,就像他父亲一样。
- In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process. 在微电子中,使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度,锡膏在晶片焊盘过焊。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- Analysis of Key Technique in Bonding Pad Design in SMT SMT焊盘设计中关键技术的分析
- Formation of circle band interface of thermosonic flip chip bonding 热超声倒装键合环状界面的形成
- Present Development of Thermosonic Flip - chip Bonding Process 芯片封装互连新工艺热超声倒装焊的发展现状
- He jotted down a note on the pad by the telephone. 他在电话机旁的便笺本草草记下一个通知。
- The shares of their company are blue chip. 他们公司的值钱而又红利稳。