The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface.

• 采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。