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- Chemical Mechanical Polishing (CMP) is the most effective way to achieve global planarization in semiconductor process. 化学机械抛光,是半导体制程中达到全域平坦化最有效的办法,同时也是众多制程中不可或缺的重要制程步骤。
- Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. 摘要:化学机械抛光是现在半导体产业中最常被使用的平坦化制程。
- Diamond disk conditioners have long served the semiconductor chemical mechanical polishing (CMP) process for polish pad dressing. 摘要钻石修整器应用于化学机械抛光中抛光垫的修整,已有很长的一段时间。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. 化学机械抛光,是目前半导体制程中达全域平坦化最有效的方式,同时也是许多制程中不可缺少的步骤。
- Boning, D., W. Moyne and T. Smith, “Run by Run Control of Chemical Mechanical Polishing,” IEEE Trans. CPMT (C), 19, 307-314 (1996). 周育乐,考虑制程使用时间之批次控制方法,台湾大学工业工程研究所硕士论文,台北,台湾(2000)。
- G. Corlett, “Targeting Water Use for Chemical Mechanical Polishing,” Solid State Technology, Vol. 43, No. 6, pp. 201-206 (2000). 蔡明莳,“化学机械研磨后清洗技术简介”,奈米通讯,第6卷,第1期,第21-27页(1999)。
- Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates. 硬盘盘基片粗抛光必须在较高材料去除率的基础上获得高表面质量。
- With compensation-oriented chemical mechanical polishing (CMP) as the carrier, the study elucidates the procedures of this method for the innovative research and development case. 以补偿式化学机械抛光为载具,作为进行创新研发之案例来阐述本方法之流程步骤。
- Chemical mechanical polishing (CMP) technology has been considered as the most effective local and global planarization technology for wafer and widely used in ULSI fabrication. 化学机械抛光(CMP)是目前唯一能够实现硅片局部和全局平坦化的实用技术和核心技术,正广泛地应用于IC制造中。
- Slurry flow weighs heavily on the performances of chemical mechanical polishing(CMP) process,wherein the pad surface will alter the flow features considerably. 抛光垫表面特性能可大大改变抛光液的流动情况,从而影响化学机械抛光的抛光性能。
- By considering the effect of the soft layer and the deformation of the abrasive particles on the material removal in chemical mechanical polishing(CMP),the solid-solid contact mode of CMP was modified. 通过分析软质层的形成、作用以及纳米磨料的自身变形对材料去除的影响,改进了CMP过程的接触力学模型;
- This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers.The emphasis is on Chemical Mechanical Polishing (CMP). 报告研究了半导体层的抛光技术,技术的发展趋势以及产品,产品应用,并介绍了材料和设备供应商。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry.The polishing pad is one of the primary consumables in CMP. 摘要:化学机械抛光,是目前半导体制程中达全域平坦化最有效的方式,同时也是许多制程中不可缺少的步骤。
- Chemical Mechanical Polishing of Sapphire Substrate 蓝宝石衬底片化学机械抛光的研究
- Development of Chemical Mechanical Polishing Slurry 化学机械抛光液的研究进展
- chemical mechanical polishing (CMP) technology 化学机械抛光(CMP)技术
- chemical mechanical polishing abrasive 化学机械抛光磨料
- chemical mechanical polishing (CMP) 化学机械抛光
- Chemical Mechanical Polishing(CMP) 化学机械抛光
- CMP ( chemical mechanical polishing ) 化学机械抛光