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- Flip Chip technology is a typical application. 倒裝晶元技術就是其中一個典型應用。
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 當電流通過焊點時，會伴隨產生焦耳熱效應和電遷移效應。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 關於單遍高可靠性倒裝片迴流密封劑領域研發工作成就的綜述。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦討論在覆晶焊點中之電流聚集效應及其溫度分佈。
- Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 採用通用有限元軟體MSC.
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成電路封裝（叩焊晶元）內部實際的電氣連接的焊料中的鉛。
- Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒裝晶元是一種性能價格比良好的互連技術 ,要求採用富有創新的操作 ,以滿足KGD的測試方法和操作工藝的需要。
- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本課題受到國家自然科學基金重大項目「先進電子製造中的重要科學技術問題研究」的資助,專門針對RFID倒裝晶元封裝設備中的預綁定模塊進行視覺系統和運動控制集成的研究。
- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介紹了幾種當前先進的MEMS封裝技術:倒裝焊MEMS、多晶元 (MCP)和模塊式封裝(MOMEMS)。
- Discuss the necessary of flip chip underfill to ther mal fatigue failures.Put forward controlling parameter for flip chip underfill. [摘要]從熱疲勞故障的角度論述了倒裝晶元底部填充的必要性 ，介紹了倒裝晶元底部填充的參數控制。
- Some typical applications in under bump metallurgy(UBM)for flip chip bumping,PC boards,LCRs and computer hard disk are reviewed. 指出,減少污染、延長鍍液使用壽命、降低成本仍然是化學鍍鎳面臨的一項長期的任務;
- CTE mismatch between silicon and BT board is so colossal that flip chip need filling underfill to keep the long-term reliability. 因覆晶封裝結構中的矽晶片與有機基板間的熱膨脹係數差異頗大，故需填充底膠以確保其長時可靠性。
- A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. 一種晶元倒裝型半導體器件，其配備的半導體晶元的表面上有多個焊盤電極。
- Compared to its predecessor, the TAL 10000, the TAL 20000 is claimed to 『provide a quantum jump』 in flip chip assembly technology for RFID inlays. 相比，它的前身，塔爾阿萬，塔爾20000宣稱是'提供一個量子跳轉'在倒裝晶元組裝技術的RFID嵌體。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 釺料凸台的製造是球柵陣列封裝(BGA, ball grid array)、晶元尺寸級封裝(CSP, chip scale packaging)及倒裝晶元封裝(FC, flip chip)等面陣封裝的關鍵技術之一。
- The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface. 採用壓力約束模式夾持倒裝晶元,實現了熱超聲倒裝鍵合,觀察到環狀的鍵合界面微觀形貌,脊狀撕裂棱以及表皮層碎片。
- In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM. 另外，由於晶元倒裝焊接的三種關鍵支撐技術的發展在很大程度上影響著MCM中倒裝焊接技術的普及應用，本文還對三種支撐技術進行了研究。
- Flip Chip (FC) technology, which is widely used in IC packaging, is introduced into the fabrication of three-dimensional packaged integrated power electronics module ( IPEM ) to construct Flip Chip IPEM (FC- IPEM). 倒裝晶元(Flip Chip,FC)技術廣泛應用於微電子封裝中,將該技術引入到三維的集成電力電子模塊(Integrated Power Electronics Module,IPEM)的封裝中,可以構成倒裝晶元集成電力電子模塊(FC-IPEM)。
- This paper mainly describes equipment manufacturers have modified the existing equipment with flexible method and vision system scheme according to the characteristics of flip chip to realize the automation of pick and place machine. 介紹了設備的製造廠家根據倒裝晶元的特點 ,採用柔性 (軟體 )方法和視覺系統等方案對現有的設備進行改型 ,從而實現了貼裝設備的自動化。
- He is a great guy, a chip off the old block. 他是一位好人，就像他父親一樣。
