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- The steam explosion and cooking pulping process is a method improved for chemico mechanical pulping. 噴爆蒸煮製漿可認為是改良的化學機械製漿技術。
- Chemical Mechanical Polishing (CMP) is the most effective way to achieve global planarization in semiconductor process. 化學機械拋光，是半導體製程中達到全域平坦化最有效的辦法，同時也是眾多製程中不可或缺的重要製程步驟。
- Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. 摘要:化學機械拋光是現在半導體產業中最常被使用的平坦化製程。
- Diamond disk conditioners have long served the semiconductor chemical mechanical polishing (CMP) process for polish pad dressing. 摘要鑽石修整器應用於化學機械拋光中拋光墊的修整，已有很長的一段時間。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. 化學機械拋光，是目前半導體製程中達全域平坦化最有效的方式，同時也是許多製程中不可缺少的步驟。
- Boning, D., W. Moyne and T. Smith, 「Run by Run Control of Chemical Mechanical Polishing,」 IEEE Trans. CPMT (C), 19, 307-314 (1996). 周育樂，考慮製程使用時間之批次控制方法，台灣大學工業工程研究所碩士論文，台北，台灣(2000)。
- G. Corlett, 「Targeting Water Use for Chemical Mechanical Polishing,」 Solid State Technology, Vol. 43, No. 6, pp. 201-206 (2000). 蔡明蒔，「化學機械研磨后清洗技術簡介」，奈米通訊，第6卷，第1期，第21-27頁（1999）。
- Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates. 硬碟盤基片粗拋光必須在較高材料去除率的基礎上獲得高表面質量。
- With compensation-oriented chemical mechanical polishing (CMP) as the carrier, the study elucidates the procedures of this method for the innovative research and development case. 以補償式化學機械拋光為載具，作為進行創新研發之案例來闡述本方法之流程步驟。
- Chemical mechanical polishing (CMP) technology has been considered as the most effective local and global planarization technology for wafer and widely used in ULSI fabrication. 化學機械拋光(CMP)是目前唯一能夠實現矽片局部和全局平坦化的實用技術和核心技術，正廣泛地應用於IC製造中。
- Slurry flow weighs heavily on the performances of chemical mechanical polishing(CMP) process,wherein the pad surface will alter the flow features considerably. 拋光墊表面特性能可大大改變拋光液的流動情況,從而影響化學機械拋光的拋光性能。
- This feature can be eliminated via mechanical polishing and followed by chemical etching, and hence only exciton line was observed for the damage-removed sample. 此篇論文中所有的化合物半導體單晶樣品，在做光學量測之前，皆有經過機械磨光以及化學蝕刻的處理。
- Investment casting with stainless steel, carbon steel, alloy steel and heat treatment. Machining with CNC mirror polishing, mechanical polishing, electro polishing, parts assembly. And products of steel fabrication. 不鏽鋼、碳鋼、合金鋼的精密鑄造、鑄件的熱處理、CNC機械加工、鏡面拋光、機械拋光、電解拋光、部件裝配及鋼結構件的生產。
- A set of conventional processing methods of vanadium and vanadium alloy specimens, including mechanical polishing, mechanical chemical polishing, chemical etching as well as relevant techniques and experiences is introduced. 摘要介紹了一種釩及釩基合金金相試樣的常規制樣方法，即試樣的機械磨光，機械化學拋光，化學侵蝕等技術和經驗。
- By considering the effect of the soft layer and the deformation of the abrasive particles on the material removal in chemical mechanical polishing(CMP),the solid-solid contact mode of CMP was modified. 通過分析軟質層的形成、作用以及納米磨料的自身變形對材料去除的影響,改進了CMP過程的接觸力學模型;
- This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers.The emphasis is on Chemical Mechanical Polishing (CMP). 報告研究了半導體層的拋光技術，技術的發展趨勢以及產品，產品應用，並介紹了材料和設備供應商。
- A complete bright silver plating process for deluxe tableware including chemical polishing, mechanical polishing, degreasing, cleaning, nickle plating, silver plating and post-treatment is suggested. 介紹餐具光亮鍍銀的全套實用工藝，包括化學拋光、機械拋光、除蠟、除油、鍍鎳、鍍銀、以及鍍后處理等。
- The processing method is used for flattening the surface of the substrate of the film circuit, thus avoiding mechanical polishing which is complicated in process, and significantly reducing the cost. 本發明用於薄膜電路基片表面的平坦化處理，可以避免工藝複雜的機械拋光，從而大幅度降低成本。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry.The polishing pad is one of the primary consumables in CMP. 摘要:化學機械拋光，是目前半導體製程中達全域平坦化最有效的方式，同時也是許多製程中不可缺少的步驟。
- Give the table a good rub with this polish. 用這上光劑把桌子好好擦一擦。
