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- Ti-Ag活性焊料Ti-Ag active alloy
- Ti/Ag/Cu活性焊料Ti/Ag/Cu active solder
- 焊料solder
- Ag-Cu-Ti活性合金焊料Ag-Cu-Ti active filler metal
- Ag-Ti活性钎料Ag-Ti active filler metal
- 锡焊料pewter solder
- 表面活性杂质surface-active impurity
- AGlipopolysaccharide (LPS)
- 用高熔点的焊料来连接。solder together by using hard solder with a high melting point.
- Ag,Ag
- 活性氯active chlorine
- 油脂表面会排斥焊料,留下氧化物裸点,并导致砂眼和杂物。Oily or greasy surfaces repel fluxes, leaving bare spots that oxide and result in voids and inclusions.
- 单体活性monomer reactivity
- δ-Ag(=δ antigen) δ抗原
- 白金焊料white gold solder
- Sn-AgSn-Ag
- 杂质活性impurity activity
- 铂焊料platinum solder
- 活性剂驱surfactant flood
- AG-DAG-D