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- Sn-Ag-Cu无铅焊点Sn-Ag-Cu lead-free joints
- Sn.Ag-Cu无铅钎料Sn-Ag-Cu lead-free solder
- 微量稀土元素铈对Sn-Ag-Cu无铅钎料物理性能和焊点抗拉强度的影响Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder
- Sn-Ag-Cu无铅钎料Sn-Ag-Cu lead-free solder
- 按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
- 无铅焊点lead-free solder joint
- 无铅焊点的可靠性研究Research on Lead-Free Solder Joint Reliability
- 这些合金具有较高的熔融温度,对金属表面的熔湿也较慢,焊点表面也不如锡-铅焊点光亮。These alloys have higher melting temperatures and wet metal surfaces more slowly, the joints also look different in that the surfaces are not as reflective as tin-lead joints.
- 无铅unleaded
- 无铅合金Sn-Ag-CuSn-Ag-Cu lead-free alloy
- 矩形片状元件无铅焊点断裂机制Fracture mechanism of lead-free soldered joints of rectangular chip component
- 无铅的lead-free
- 无铅汽油white gasoline
- 无铅釉lead free glaze
- Sn-Ag基无铅焊料的研究与发展The Research and Development of Pb-free Sn-Ag Base Solders
- 无铅焊点可靠性测试和数据分析Lead-Free Solder-Joint Reliability Tests and Data Analysis
- 无铅漆leadless paint
- 无铅辛烷值unleaded octane rating
- 无铅焊Pb- free
- 无铅化unleaded
