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- Low-K flip chip device 低k倒装焊器件
- Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
- A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. 一种芯片倒装型半导体器件,其配备的半导体芯片的表面上有多个焊盘电极。
- This low-power device integrates precise temperature, voltage, and current measurement, nonvolatile data storage, and Li+ protection into the small footprint of either a TSSOP package or flip chip. 这款低功耗器件集成了温度、电压和电流的精密测量、非易失数据存储和锂电池保护等功能,封装于占位面积极小的TSSOP或倒装片。
- And exceed medium of the copper between low K metal (interrelate) promise to reduce interrelating electric capacity. 而且超低k金属间铜介质(互连)答应降低互连的电容。
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时,会伴随产生焦耳热效应和电迁移效应。
- Granulite in Jinshuikou defferent with other granulites on low K、Na,unconspicuouly negative of Rb. 2. 金水口麻粒岩以低K、Na含量,没有明显的Rb亏损不同于其它麻粒岩。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
- FSG, as one kind of low k dielectric film, is very similar with SiO2 in structure and deposition, and can be well used in 0.18-0.13um ULSL. 氟掺杂的氧化硅玻璃(FSG)作为低介电常数材料的一种,它的制备工艺、结构和性能更接近二氧化硅,足以满足0.;18微米甚至0
- Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元软件MSC.
- The synthesis, structure, properties and process interaction of low k dielectrics are reviewed.Characterization techniques for low k dielectric films are summarized. 综述了低介电常数介质薄膜的制备方法、结构与性能表徵、工艺兼容性等领域的最新进展。
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装(叩焊芯片)内部实际的电气连接的焊料中的铅。
- A stand-alone chip device (usually 40-pin) that is designed for dedicated computing and control applications, it requires few or no support circuits. 一种专用于计算和控制的独立芯片器件(通常有40条引线),它不需要或很少要求别的电路支持就能工作。
- Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒装芯片是一种性能价格比良好的互连技术 ,要求采用富有创新的操作 ,以满足KGD的测试方法和操作工艺的需要。
- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本课题受到国家自然科学基金重大项目“先进电子制造中的重要科学技术问题研究”的资助,专门针对RFID倒装芯片封装设备中的预绑定模块进行视觉系统和运动控制集成的研究。
- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
- The calculation result shows that the possible SI mechanism (i. e. , the competition between the n - p interaction and the coriolis force in low K space) is also appropriate for odd-odd nuclei in the A = 100 region. 计算结果表明,可能的旋称反转机制(即:低K空间n-p相互作用和科氏力的相互竞争),对于A=100质量区奇奇核也是适用的。
- An Integrated Charge--Control J--K Flip--Flop 一个电荷控制的整体式J-K触发器
- Discuss the necessary of flip chip underfill to ther mal fatigue failures.Put forward controlling parameter for flip chip underfill. [摘要]从热疲劳故障的角度论述了倒装芯片底部填充的必要性 ,介绍了倒装芯片底部填充的参数控制。