FSG, as one kind of low k dielectric film, is very similar with SiO2 in structure and deposition, and can be well used in 0.18-0.13um ULSL.

• 氟掺杂的氧化硅玻璃（FSG）作为低介电常数材料的一种，它的制备工艺、结构和性能更接近二氧化硅，足以满足0.；18微米甚至0