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- IC packaging and testing firms 集成电路封装及测试公司
- In the IC packaging and testing has seen a typical phenomenon, a roaming from start to finish, not used by ordinary attacks, all the skills to use. 在封测曾经见到过一个典型现象,一个漫游从开始到结束,没用过普通攻击,全是用的技能。
- Focus on the stability of sub-industries performance, the IC design industry has minimum volatility, secondary is lead-frame, photomask and IC packaging and testing industries. 四、子产业绩效表现之稳定性,以IC设计业的波动最小,其次为导线架业、光罩业及IC封装测试业;
- Amkor Technology try to be the leading innovator in the IC packaging and test industry supporting the most successful semiconductor companies in the world. 公司致力于IC封装测试业的领先者和创新者,支持世界上大多数成功的半导体企业。
- packaging and testing firms 封装及测试公司
- Responsible for verification and testing of digital IC designs. 负责数字前端IC设计验证和测试。
- Used in transparent packaging and stationery type. 适用于超透明封箱及文具胶带使用。
- As I have already stated, I encourage you to download the package and test it for yourself. 正如已经提到过的,我鼓励您下载这个包,并自己来测试它。
- Southeast Asian Packaging and Canning Ltd. 东南亚包装的和装于罐中的有限公司。
- He demonstrated the principles with chemicals and test tubes. 他借助化学药品和试管讲解了这些原理。
- Proficient drawing and testing for crane parts. 精通图纸和起重机安装和测试程序。
- At the front-end, many trading firms are now engaged in the design and engineering aspects. At the back-end, they do testing, packaging and shipping, and marketing and distribution. 在前端方面,不少贸易公司正从事设计及工程等工作,而在后端方面,则负责测试、包装、付运、市场推广及分销。
- Inspection and testing certificate issued by. 由。签发之检验证明书。
- Technical requirements and testing methods for und. 水下胶粘剂技术要求和试验方法。
- The measurements are of great significance for analyzing the ESD phenomenon during inlay packaging and defining the ESD specification of the IC chip. 这些测量数据,对进一步分析制卡层压工序ESD现象,以及身份证模块ESD指标的确定具有重要的意义。
- Quality Inspection and Testing Dept. 质检试验部。
- This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems. 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
- Power facilities repairing and testing station. 电力公司修试所
- It discusses not only a kind of new Vacuum Jointing Process in IC Packaging but also its theory and background. Besides, it enumerates the remarkable achievements by implementing this process. 摘要论述了在集成电路生产中一种新的真空烧结工艺,讨论了它的理论依据及产生背景,并列举了通过实行该工艺所带来的显著成绩。
- New part measurement and testing. 新零件的测量和试验工作。