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- The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface. 采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。
- In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM. 另外，由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着MCM中倒装焊接技术的普及应用，本文还对三种支撑技术进行了研究。
- MCM Flip Chip Bonding Technology Research MCM中倒装焊接技术研究
- Formation of circle band interface of thermosonic flip chip bonding 热超声倒装键合环状界面的形成
- High viscosity, thixotropic paste for wire tacking, chip bonding and coil terminating. 高粘性,触变膏体,用于导线定位、片结合、线圈终端。
- Present Development of Thermosonic Flip - chip Bonding Process 芯片封装互连新工艺热超声倒装焊的发展现状
- Flip Chip Bond Technique Related to CMOS SEED Smart Pixels 与CMOS-SEED灵巧象素相关的倒装焊工艺
- Multimode vibration analysis of transducer in thermosonic flip chip bonding 热超声键合换能系统振动多模态分析
- Flip chip bonding technology used in modern micro-photoelectron package 现代微光电子封装中的倒装焊技术
- Study on Thermosonic Flip Chip Bonding under Pressure Constraint Pattern 压力约束模式下热超声倒装键合的试验
- He is a great guy, a chip off the old block. 他是一位好人，就像他父亲一样。
- Surface Mounting and Chip Bonding Technology 表面组装与芯片键合混合工艺浅探
- She is the flip side of Cinderella. 她的命运相当于童话中的灰姑娘。
- Keywords thermosonic flip chip bonding;bonding process monitoring;vibration propagation;bonding mechanism;bonding reliability;novel TSFC bonding process;atom diffusion; 热超声倒装键合;键合过程监测;运动传递;键合机理;键合强度;键合可靠性;新型倒装键合工艺;原子扩散;
- Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
- The shares of their company are blue chip. 他们公司的值钱而又红利稳。
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- I had a quick flip through the book and it looked very interesting. 我很快翻阅了一下那本书，看来似乎很有趣。
- Experimental Research of Chip Bonding Epoxy Residual Stress 键合技术中键合胶残余应力检测的实验研究
- This glue makes a good firm bond. 这种胶水粘得很结实。
