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- Cu-Ni-Be合金Cu-Ni-Be alloy
- 微量Mg对 Ni-2.5%Be合金组织、性能和热处理制度的影响Influence of trace Mg on the microstructure properties and heat treatment regime of alloy Ni-2.5 wt%25Be
- 结果表明:(1)Cu-Be合金活化后,表面生成较为纯净的BeO层。 氧化使得ESCA Be 1 S峰由111.6eV(电子结合能)移至113.6eV,使得Be KLL Auger峰由104eV(电子动能)移至约93eV;The results show that (1) after activation a clean BoO layer formed on the surface of CuBe alloy, The ESCA peak Bels shifts from 111.6 eV (binding energy) to 113.6eV and the Auger peak Be kLL shifts from 104eV (electron energy) to about 93 eV with oxidation of Be.
- Cu-Ni-Cr-Be-Ti合金Cu-Ni-Cr-Be-Ti alloy
- Cu/NiCu/Ni
- Ni-Cu-PNi-Cu-P
- Be-Al合金Be-Al alloys
- Ni合金Ni alloy
- Cu/NiCu/Ni
- W/Cu合金W/Cu alloy
- Cu-Ag合金Cu-Ag alloy
- Ti-Cu-NiTi-Cu-Ni
- Ni-P合金Ni-P alloy
- Ni-Co合金Ni-Co alloy
- Cu-Ni团簇Cu-Ni clusters
- Cu-Sn合金Cu-Sn alloy
- Mo-Cu合金Mo-Cu alloy
- Cu-Ni-SiCu-Ni-Si
- Zn-Ni合金Zn-Ni alloy
- Ni基合金Ni-based alloy