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- Cu金属化Cu metallization
- 集成电路Cu金属化中的扩散阻挡层Diffusion Barrier of Cu Metallization in ULSI
- 淬火速度及冷加工与Pd-Si-Cu金属玻璃结构弛豫谱之关系THE RELATION OF QUENCHING VELOCITY AND COLD WORKING TO STRUCTURAL RELAXATION SPECTRUM OF Pd-Si-Cu METAL GLASS
- 传统的Al金属互连技术已经不能满足现代互连技术发展的需要 ,大马士革结构的Cu金属互连技术已成为互连技术的重点发展方向之一。The traditional Al metallization could not meet the requirements for the development of interconnect technology. Developing damascene Cu metallization has become the main trend recently for the interconnect technology.
- 金属化安全膜防爆电容器的防爆原理及发展概况Principle of Explosion Proof and General Situation of Development for Metallized Safety Film Explosion Proof Capacitors
- 钨金属化Tungsten-metallization
- 环金属化cyclometalated
- 金属化层metallization
- DNA金属化DNA metallization
- 孔金属化Hole metalizing
- 自金属化Self-metallization
- 锆金属化层zirconium metallic coating
- 孔壁金属化The via hole
- 生物金属化biometallization
- 金属化薄膜Metallized film
- 二次金属化Second metallizing
- 织物金属化metal surface treatment
- 金属化反应metalation
- 金属化封装metalized package
- 金属化整理metallic finishing