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- Cu基活性钎料Cu-based active filler metal
- 镍基活性钎料nickel-based active filler metal
- 采用钛基活性钎料高温钎焊高强石墨High Temperature Welding of High Strength Graphite Using Titanium-Based Active Filler
- Cu基钎料MIG钎焊接头断裂行为分析Fracture Behavior Analysis of MIG-brazed Joint with Cu-based Filler Metals
- Cu基板Cu substrate
- Ag-Cu-Ti活性钎料Ag-Cu-Ti active filler metal
- 转糖基活性beta-galactosidase
- Cu基合金Cu base alloy
- 清除自由基活性antioxidant
- Cu基非晶Cu-based bulk amorphous alloy
- 活性钎料active filler metal
- 活性钎焊active brazing
- Cu基复合材料copper matrix composite
- 沥青基活性碳纤维pitch based activated carbon fibers
- Cu基非晶合金Cu-based amorphous alloys
- Ag-Ti活性钎料Ag-Ti active filler metal
- Cu基块状非晶Cu-based bulk amorphous alloy
- 粘胶基活性碳纤维viscose rayon - based activated carbon fibre(VACF)
- Zn-Al-Cu基合金Zn-Al-Cu base alloy
- 利用周模型对Sn-Ag-Cu-Ce无铅钎料合金体系进行了热力学计算预测。Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.