您要查找的是不是:
- BGA封装BGA packaged
- 无铅BGA封装lead-free BGA assembly
- 无铅BGA封装可靠性的跌落试验及焊接界面微区分析Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface
- 本节包括:适用BGA封装类型的项视详图和引脚分配。This section contains the top-view illustrations and pin assignments for applicable BGA package types.
- BGA封装过程演示和终端分配表格,如果可采用的话(图1为包括)BGA packaging top-view illustration and terminal assignments table, if applicable (not illustrated in Figure 1)
- FC-BGAFC-BGA
- BGA器件的筛网印刷考虑Screen Printing for BGA Component
- 基于点模式的BGA芯片定位算法研究Research on Image Locating Algorithm with BGA Package Based on Point Pattern Match
- 红外加热技术在BGA返修焊接中心的应用Application of Infrared Heating Technology to BGA Rework Soldering Center
- 无铅BGA再加工时需要考虑的主要问题是什么?What are the main concerns associated with reworking lead-free BGAs?
- 独有内置吸盘吸放组件,满足BGA不触的特性。Unique built-in sucker is used to lift up and place the component to meet BGA non-touch nature.
- TCP封装TCPencapsulation
- TO封装TO packaging
- 铝封装aluminum encapsulation
- 封装变化Find what varies and encapsulate it
- UDP封装UDP encapsulation
- IC封装IC package
- 封装胶encapsulation
- 3D封装3D package
- CSP封装CSP package