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- 超薄型IC封装技术packaging for ultra-thin ICs
- 超薄型圆片级芯片尺寸封装技术Ultrathin Wafer Level Chip Size Package Technology
- 非接触型IC卡The Untouched IC Card
- IC封装IC package
- 应用喷墨技术的超薄型多层板的开发Development of Super Thin Multilayer Board with Ink Jet Technology
- IC封装的扩晶装置结构设计Structural Design of Wafer Expansion Device for IC Encapsulation
- 超薄型层压板ultra thin laminate
- IC封装设备划片机的研制Development of Wafer Incision Machine for IC Encapsulation
- 超薄型平板缝隙阵Super-thinner plate slots array
- 采用新型多层基板的多芯片组件封装技术Packaging Technology for Multichip Module Using New Type Multilayer Substrate
- 超薄be ultra-thin
- 外型exterior
- 户型house type
- 光纤布喇格光栅高温敏封装技术的研究High-sensitivity Fiber Bragg Grating Temperature Sensor with Polymer Jacket
- 笔型pen type
- 整型integer
- 电子封装技术electronic encapsulating technology
- 运动型motile
- 多芯片封装技术multi-chip packaging(MCP) technology
- 表型phenotype
