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- 芯片尺寸封装(CSP)技术The Chip Size Package Technology
- 超薄型圆片级芯片尺寸封装技术Ultrathin Wafer Level Chip Size Package Technology
- 芯片尺寸封装CSP
- 叠层芯片尺寸封装Stacked chip scale package
- 晶圆级芯片尺寸封装技术及其应用Wafer Level Chip Size Package Technology and its Applications
- 圆片级芯片尺寸封装wafer-level chip scale packaging
- 晶圆级芯片尺寸封装WCSP
- 珠钢CSP轧机控制技术特点TYPICAL OF CONTROL TECHNOLOGIES FOR CSP FINISHING-MILL IN ZHUJIANG STEEL PLANT CSP MILL
- CSP封装CSP package
- 为适应底部CSP较大的球体尺寸及使用焊膏和助焊剂,对上述技术必须进行某些改动。Some modifications are required to accommodate the larger ball size of the bottom CSP as well as the use of solder paste in addition to flux.
- 微粒速度与尺寸同时测量的技术Research on Measuring the Speed and Dimension of Corpuscle
- 表面封装技术SMT - Surface Mount Technology
- 晶圆尺寸级封装WLCSP
- 猪源致病性沙门氏菌耐药基因PCR和基因芯片检测技术研究PCR and Gene Chip Detection Methods of Antimicrobial Resistance Genes of Pathogenic Salmonella from Swine
- 针对工件尺寸测量的现场标定技术Field Calibration Technique for the Dimension Measurement of the Work Piece
- 单封装芯片SANYO Ultimate Super One Chip
- 也门塔维拉6井大尺寸套管修复技术Repairing technology for casing of large size of Well Taveira-6 in Yemen
- 芯片封装专利chip packaging patent
- 基于回收的磨损尺寸胀修恢复技术Abraded Dimension Restore Technology by Elastic-Plastic Deformation for Recycling
- 芯片规模封装Chip scale package
