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- 电镀Ni（Bi）electroplating Ni(Bi)
- 电镀Nielectro-deposited nickel
- 电镀galvanization
- 研究了电镀Ni层和化学镀Ni P合金层对Sn Ag/Cu焊点扩散行为的影响 ,电子探针分析表明 :化学镀Ni P合金层能很好地阻止Sn Ag/Cu焊点在焊接过程中的Cu ,Sn互扩散和相互反应 ;The effects of electroplated Ni layer and electroless plated Ni P layer on the diffusion behavior in Sn Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni P layer acted as a good diffusion barrier between Sn Ag solder and Cu substrate.
- BI-1BI-1
- 电镀的electroplating
- Bi相Bi Phase
- 富BiBi excess
- Ni-PNi-P
- Bi元素bismuth element
- 电镀液plating solution
- 7-NI7-Nitroindazole
- Bi-补偿bistatic compensation
- Ag-NiAg-Ni
- BI废水BI organic wastewater
- 电镀槽plating bath
- 镀Ninickel plated
- Bi薄膜Bi film
- 电镀铰链a galvanized hinge
