您要查找的是不是：
- wire bonding materials 引线键合材料
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Bonding material not present if required. 在有要求时,却没有粘贴物质。
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样，在打线作业时，该第二基板的悬空部分不会有摇晃或是震荡的情况。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- The development and proceeding on surface modification technology of hard bonding materials, such as PE, PP and PTFE, were reviewed in this paper. 本文综述了聚乙烯、聚丙烯、聚四氟乙烯等难粘材料的表面处理技术的发展状况和新进展。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- The results show that the technique of using epoxy resin adhesives as bonding materials between steel thimble and GFRP bars is practicable. 研究表明采用环氧类树脂粘结剂进行钢套管和GFRP筋的连接，技术可行；
- This article briefly introduce the key process in semiconductor assembly-ultrasonic wire bonding, about its theory, application area and key technology. 简要介绍了半导体封装过程中的关键工艺--超声波压焊工艺的原理,应用范围和主要关键技术;
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- The foreign large corporations of bonding materials, including EMS and TMI, mainly focus on the development and application of combining the bonding materials. 国外复合金属大厂如EMS、TMI主要著重于复合金属材料组合之开发应用，而本计画除积极累积材料组合研发经验外更藉由设备技术开发来提升复合金属之精度与性能。
- To deal with bonded materials and duty exemption affairs. 办理保税物资及免税事宜.
- Photopolymerization was used in coating, printing inks, adhesives, and biological applications such as dental restoratives, restorative bond materials. 目前该技术已经广泛应用于油墨、涂料、胶粘剂以及齿科、骨科修复材料等生物医用材料领域。
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- Planning Manage handbook and bonded material. 监管相关手册以及保税商品的记录。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
- Any of various bonding materials used in masonry, surfacing, and plastering, especially a plastic mixture of cement or lime, sand, and water that hardens in place and is used to bind together bricks or stones. 灰浆任何一种用于石造物、表面和涂盖的粘合物质，尤指用水泥、石灰、沙和水的塑料混合物来硬化涂抹处，被用于粘合砖或石头
- Success of the operation is decided by the properties of bonding materials, assistant fixed prepartions and the healing pattern of the implant reattached tooth in the alveolus socket. 影响断牙再接术成功的主要因素有黏结材料的性能，再接时采用的辅助固位方式，若为根折尚包括再接牙植入牙槽窝内的愈合形式等。
- Success of the operation is decided by the properties of bonding materials,assistant fixed prepartions and the healing pattern of the implant reattached tooth in the alveolus socket. 影响断牙再接术成功的主要因素有黏结材料的性能,再接时采用的辅助固位方式,若为根折尚包括再接牙植入牙槽窝内的愈合形式等。
