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- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Among them the lowest impedance and the best mechanical quality, it is the first kind type piezoelectric wire bonder. 其中阻抗最低且机械品质最佳的，则是第一种型式的压电打线器。
- Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied. 摘要基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
- Keywords: piezoelectric wire bonder, displacement, actuating force, impedance, mechanical quality. 关键字：压电打线器、位移、致动力、阻抗、机械品质。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding. 目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。
- The Calibration System Design of Wire Bonder 全自动引线键合机校正系统设计与实现
- Ultrasonic transfer on horn of wire bonder 超声波在引线键合机变幅杆中的传递规律
- Technology Analysis Of Wire Bonder 引线键合机工艺技术分析
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样，在打线作业时，该第二基板的悬空部分不会有摇晃或是震荡的情况。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- This article briefly introduce the key process in semiconductor assembly-ultrasonic wire bonding, about its theory, application area and key technology. 简要介绍了半导体封装过程中的关键工艺--超声波压焊工艺的原理,应用范围和主要关键技术;
- A kite dangles from a telephone wire. 一只风筝悬挂在电话线上晃来晃去。
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- This glue makes a good firm bond. 这种胶水粘得很结实。
- Common tastes form a bond between the two men. 共同的爱好使两人结交为朋友。
- With deft fingers she untangled the wire. 她用灵巧的手指解开了金属线。
