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- To understand the mechanics of wafer warpage, research is performed on the effect of the lift-off procedure and material thickness on wafer warpage. 本研究进一步为了解晶圆翘曲的力学特性，研究雷射剥离过程及材料厚度，对氮化镓发光二极体晶圆翘曲之影响。
- The wafer warpage curve is 2nd order polynomial, therefore the warpage results of a 2” wafer can be calculated from smaller models to reduce calculation time. 利用晶圆翘曲为二次多项式曲线之关系，两吋晶圆之翘曲可由较小半径模型之翘曲求得，以节省计算时间。
- wafer warpage 薄片弯曲
- A thin, crisp wafer or biscuit, usually made of unsweetened dough. 薄脆饼干一种通常由不含糖的生面团做成的薄脆饼干
- Surface smoothness and low warpage. 表面平滑,低翘曲性。
- Now people can produce a wafer silicon. 现在人们能够生产一种硅晶薄片。
- The sundae was topped with chocolate and a wafer. 这个圣代冰淇淋顶部覆盖着巧克力和威化饼干。
- Body Styles Tapped full lug or wafer. 阀体类型可钻孔的全凸耳或对夹式。
- Wafer body features four alignment holes. 平板阀体配置四个校对孔。
- The wafer was placed on the powered electrode. 硅片被放置于功率电极上。
- Oreo chocolate Wafer is a new member of the family. 奥利奥巧克力威化是奥利奥家族的新成员。
- The brass body &stainless steel wafer. 铜制品并镶有凸面不锈钢片。
- I like to eat chocolate wafer cery much. 我非常喜欢吃巧克力威化。
- They were not satisfied that they could not use underground wafer. 他们对不能使用地下水感到很不满。
- The initial stress of wafer from the manufacturing process is calculated using process modeling.The effect of the lift-off procedure on warpage is simulated using 2-D and 3-D models, respectively. 利用制程模拟使模型具有制程后因热膨胀系数不匹配所造成之应力，并分别以二维及三维模型，分析不同剥离方法对翘曲量之影响。
- Bond strength is an important parameter for wafer bond. 键合强度是关系到键合好坏的一个重要参数。
- Cook rolled out the pastry till it was as thin as a wafer. 厨师把和好的面擀得非常薄。
- The reported Warpage values may be lower than actual due to voiding. /纪录的弯曲度数值可能比实际应用的低。
- The Pope then brought out a communion wafer and a chalice of wine. 教皇拿出了领圣体用的饼,还有一杯圣酒。
- Adjusting delay time and gas pressure can reduce the warpage of the part. 工艺上可以通过调整延迟时间和气体压力来减小产品的变形量。
