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- Bond strength is an important parameter for wafer bond. 键合强度是关系到键合好坏的一个重要参数。
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
- An equipment for vacuum wafer bonding was developed based on the wafer bonding technology. 摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。
- Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field. 摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
- Four fundamental manufacturing technologies namely bulk micromachining,surface micromachining,moulding and wafer bonding are introduced for Micro Electro Mechanical System(MEMS). 介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
- Over coming lattice and orientation mismatch, direct wafer bonding allows fabricating of structures and devices which can 抰 get through hetero-epitaxial growth. 利用键合技术可以集成晶格或晶向失配的材料，制造传统外延生长技术不能制造的结构和器件。
- Measurements of the Bond Strength for Wafer Bonding 硅片键合强度测试方法的进展
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- Timing Test for Picking Up of Wafer Bonding Machine 硅片焊接机拾起硅片时序测定方法
- This glue makes a good firm bond. 这种胶水粘得很结实。
- Common tastes form a bond between the two men. 共同的爱好使两人结交为朋友。
- The Advances in Wafer Bonding and MEMS 晶圆键合技术与微电子机械系统新进展
- wafer bonding and mechanicalthinning 键合减薄
- The bond that binds the smugglers together is a rope of sand. 把走私犯联接起来的是条沙做的绳子，一碰就碎。
- Common interests formed a bond between us. 共同的利益把我们联系在一起。
- Identity of interests is the bond that unites them. 利害的一致是把他们联合起来的纽带。
- A unifying bond, especially a marriage bond. 结合一种联结的纽带，尤指婚姻纽带
- Development of a Multifunctional Equipment for Vacuum Wafer Bonding 多功能真空键合设备的研制
- Realization of Testing Wafer Bonding Quality with Cold Light Source 冷光源检测晶片键合质量的实现
- A bond of sympathy developed between members of the group. 该组织成员间产生了志同道合的凝聚力。
