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- This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. 本标准用于确定非气密封装的表面安装器件(SMD)的湿气敏感度等级。
- These ceramic components make ideal surface mount devices (SMDs) and are eminently suitable for telecommunications, automotive and entertainment electronics applications. 这些陶瓷元件可制作理想的表面安装元件(SMDs),并且非常适合于通信、自动推进和娱乐电子的应用。
- surface mount device 表面装置器件
- REEL TAPING SPECIFICATIONS FOR SURFACE MOUNT DEVICES FLAT TYPE MELF TYPE 表面贴装器件带装规格
- These parts are surface mount inductors. 表面贴装电感器。
- This new device is intended to also be offered in a plastic 8-pin SOIC surface mount package starting in approximately September 2007. 此款新器件自2007年9月左右起还将提供8引脚塑胶SOIC表面安装封装。
- The WL-CSP fully complies with joint electron device engineering council (JEDEC) and surface mount technology (SMT) standards. WL-CSP封装完全符合JEDEC和SMT标准。
- No Chinese investment corporation produces surface mount fuses. 表面贴装没有中资企业生产。
- surface mount devices (SMD) 表面贴装集成电路
- Locate and unsolder surface mount resistor "A" (see picture below) be carefull! 找到并去除贴片电阻“”(看下图)要小心!
- surface mounted device 表面安装器件
- Surface mounting device 表面贴装器件
- Surface mounting and side entry type. 表面安装,侧面进线形式。
- Surface mounting and top entry type. 表面安装,正面进线形式。
- Package type EW (0.40 mm maximum height) offers a leadless surface mount solution. EW类型封装(最高为0.;40 mm)提供无铅表面安装解决方案。
- Low solids flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads. 用于表面安装组件的低固态物焊剂,有助于减少表面安装焊盘底侧的遗漏现象。
- MFJ QRP-Cub Transceivers use Surface mount Technology to achieve big performance in a pocket-sized package. MFJ QRP -幼童收发器使用表面贴装技术,以实现大的性能在口袋大小的包。
- The article introduces SPC method and the application of SPC in surface mount technology. 本文介绍了SPC法及其在表面贴装工艺中的应用。
- Keywords Adhesive for surface mounting devices Thixotropy Legging Point coating; 贴片胶;摇溶性;拉丝;点涂;
- Shows all mountable devices and (un)mounts them on request. 显示所有可挂载设备并根据需要挂载或卸载它们。
