您要查找的是不是：
- Poor wettability of lead-free solder brings about challenge to present electronic assembly technology.Nitrogen protection can improves wettability of lead-free solder and solder joint quality. 无铅钎料差的润湿性给传统电子组装工艺带来了巨大的挑战,氮气保护有利于改善无铅钎料的润湿性,提高焊点质量。
- Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality 冷却速率对无铅钎料和焊点质量影响
- The Technology of SMT Solder Joint Quality Automatic Testing and Intelligent Detecting SMT焊点质量自动检测与智能鉴别技术
- solder joints quality 焊点质量
- Solder Joint Quality 焊点质量
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面组装技术(SMT)形成的产品，其焊点质量直接影响到产品的可靠性和寿命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性。
- Heat solder joints only to the point were solder will flow properly. Excessive heat may distort brass castings. 热焊料连接只能用在焊料能够正确流动的地方。过热可能扭曲黄铜铸件。
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives. 改善后的颗粒结构还能够让焊锡结合点的光洁度明显优于传统的无铅合金替代品。
- Q: Will IPC be publishing a new specification for inspection of lead-free solder joints? IPC是否会颁布新的关于无铅焊接的质检标准?
- Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula. 在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命。
- It is shown that 96.8 percent of defects inside solder joints are inspec-ted successfully. 结果表明;对盘焊缺陷的检测成功率达96.;8%25。
- Atoms in the solder joints move as a result of both diffusion and electromigration. 另一方面，扩散和电迁移效应，则造成焊点中的原子移动。
- However, in the eutectic SnBi solder joints, the constituted elements are Sn and Bi. 但是，在共晶锡铋焊点中，组成的元素为锡和铋而非单一元素。
- The resulting solder joints have demonstrated improvements in grain structure and have shown a marked increase in reliability. 得到的焊点的晶粒结构得以改善,焊点的可靠性得到了显著提高。
- This flux's finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. 该类型焊剂具有精心研制的活化配系,可以提供现有无挥发性有机物液体助焊剂技术中最佳的熔湿能力和最光亮的焊接点。
- Nitrogen like in the tin-lead system will offer smoother solder joints and better wetting will be gained with the use of nitrogen. 与锡-铅系统类似,氮气可以使焊点更为光滑;使用氮气还可以得到更好的熔湿性。
