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- silicon wafer surface cleaning 硅片表面清洗
- The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically. 对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。
- The results indicate that all the chelating agents of PAA,HEDP and AMPS can obviously reduce Cu deposition on silicon wafer surface,and the ability to reduce Cu deposition by 83%,79%,44% respectively. 结果表明;PAA、HEDP和AMPS的加入都能明显减少金属铜在硅片表面的沉积量;去除率分别为83%25、79%25和44%25.
- The diamond and Fullerene abrasive tools with superfine grains were prepared, and the grinding tests on silicon wafer surface was carried out with this two kinds of abrasive tools. 制备了超微粒金刚石和富勒烯研磨工具,并分别进行了硅片研磨试验,详细分析了两种材料的研磨特性如表面粗糙度的稳定性、磨料粒度对研磨效果的影响以及研磨材料的显微结构等。
- Silicon wafer surface passivation for solar cell 太阳电池用硅片表面钝化研究
- Sticking Behavior of Acidic and Basic Compounds in Clean Room Air onto Silicon Wafer Surface 洁净室空气中酸性和碱性化合物在硅晶片表面的沾附特性
- Surface cleaning on quartz, silicon and glass substrates. 半导体晶片或玻璃基底的清洗。
- Contamination Particulate - Particles found on the surface of a silicon wafer. 沾污颗粒-晶圆片表面上的颗粒。
- SiO2, an insulator, can be formed by oxidation of surface of the silicon wafer. 经净化的晶棒接著用机械方法切成薄片.;这些切片就叫做晶圆
- KEN W. The evolution of silicon wafer cleaning technology[J]. J Electrochem Soc, 1990,137(6):1887. 曹宝成，于新好，马瑾;等.;用含表面活性剂和螯合剂的清洗液清洗硅片的研究[J]
- XPS and EIA Studies of Site-directed Immobilization of IgG Molecules onto Single Crystal Silicon Wafer Surfaces IgG分子在单晶硅片表面导向性固定的XPS和EIA研究
- Hot plate with silicon wafer lowered to heating position. 加热板与矽晶圆降低至加热位置。
- Scratch - A mark that is found on the wafer surface. 擦伤-晶圆片表面的痕迹。
- Mechanical Test Wafer - A silicon wafer used for testing purposes. 机械测试晶圆片-用于测试的晶圆片。
- For the tub, vanities, marble surface cleaning and maintenance. 用于浴盆、面盆、大理石表面清洁保养。
- ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer. 光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。
- Carrier - Valence holes and conduction electrons that are capable of carrying a charge through a solid surface in a silicon wafer. 载流子-晶圆片中用来传导电流的空穴或电子。
- Low base pressure is also a requirement to keep the surface clean. 低的基本压强也是保持表面清洁所要求的。
- Fixed Quality Area( FQA)- The area that is most central on a wafer surface. 质量保证区(qa)-晶圆片表面中央的大部分。
- Hot plate with silicon wafer in initial configuration (before heating). 加热板与矽晶圆在启始状态(加热前)。
