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- It's used for lapping quartz crystal slice,silicon slice,germaniutn slice,glass,porcelain slice,piston ring,clique,slice,horologe glass,molybdenum slice,sapphire,ferrite,PTC,etc. 产品广泛用于石英晶体片、硅、锗片、玻璃、陶瓷片、活塞环、阀片、钟表玻璃、铝铁硼、钼片、蓝宝石、铁氧体、铌酸锂、PTC等各种金属材料、非金属材料的平面研磨及活塞环的喷砂和珩磨。
- Ningjin monocrystalline silicon Zone is the biggest production basis of monocrystalline silicon in the world and is the biggest processing center for silicon slice. 宁晋单晶硅园区拥有从拉晶,切片到太阳能电池板制作的完整产业链条,是世界最大的太阳能级单晶硅生产基地和中国最大的硅片加工中心。
- crown ether silicon slice cleaning agent 冠醚硅片清洗剂
- Single-crystalline silicon slice 单晶硅片
- Free abrasive wire saw technique is the main method for monocrystalline silicon slicing process. 游离磨料线锯切割技术是目前单晶硅切片的主要加工方法。
- CHEMICAL ETCHING BEHAVIOR OF SINGLE-CRYSTAL SILICON SLICE 单晶硅化学蚀刻行为的研究
- He doubled his slice of bread to make a sandwich. 他将一片面包对摺做成三明治
- Based on the theory of hydrodynamic lubrication,hydrodynamic action in the free abrasive monocrystalline silicon slicing process using a wiresaw was studied. 基于流体动压理论,研究了单晶硅自由磨料线锯切片过程中的流体动压效应。
- GaAs films have been deposited on substrates of quartz glass and silicon slices by radio frequency magnetron sputtering technique in the atmosphere with or without hydrogen. 作者单位：五邑大学薄膜与纳米材料研究所;华南理工大学物理科学与技术学院;
- He has spread a slice of bread with Jam. 他把面包片抹上了果酱。
- Chemical Etching on Single-crystalline Silicon Slice and its Surface Morphology 化学蚀刻单晶硅及其表面形貌研究
- Give me a slice of bread please. 请给我一片面包。
- She filmed a slice of bread with butter. 她涂一层薄薄的奶油在一片面包上。
- The silicon chips are less than a millimeter thick. 这些矽片厚度不足一毫米。
- Each partner receives his slice of profits. 每一个合伙人得到他的一份利润。
- Abalone slice with oyster sauce is the best of our kitchen. 蚝油鲍鱼生是我们厨房的最拿手的好菜。
- For breakfast, she had only a slice of bread and butter. 她早餐只吃了一片奶油面包。
- The entire content of a book will be located on a single silicon chip. 整本书的内容只用一片硅芯片就可以装下。
- Test method for measuring flexure strength of silicon slices GB/T15615-1995硅片抗弯强度测试方法
- thirdly, the first silicon slice and the second silicon slice are cut along the predetermined cut line so as to form a plurality of separated multichip packaging structures. 最后，沿着预定的切割线切割第一硅片以及第二硅片，以形成多个分离的多芯片封装结构。
