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- Theoretical Analysis on Bonding Energies for Silicon Direct Bonding 直接键合硅片界面键合能的理论分析
- Low Temperature Silicon Direct Bonding With Oxygen Plasma Activating 用氧等离子体激活处理的低温硅片直接键合技术
- Model and Simulation of Impurity Distribution for Silicon Direct Bonding 硅片直接键合杂质分布的模型与模拟
- Fabrication of Uniform Crystal Silicon Membrane Using Two-Step Silicon Direct Bonding Technology 用两次键合技术制备均匀单晶硅膜
- Keywords Gate Commutated Thyristor （GCT）;transparent anode;field stop layer;isolation technique;gate-cathode layout;silicon direct bonding （SDB）; 门极换流晶闸管;透明阳极;场阻止层;隔离技术;门-阴极图形;硅-硅直接键合;
- silicon direct bonding 硅片直接键合
- Silicon direct bonding (SDB) 硅-硅直接键合
- The clinical application of direct bonding fixed retaining wire. 直接粘接式固定保持弓丝的临床应用。
- Successful Silicon-to-silicon direct bonding(SDB)mainly depend on the hydrophilicity treatment of silicon surface.Micro-mechanism of hydrophilicity has been analyzed in the paper for the first time. 硅片直接键合(SDB)技术的关键在于硅片表面的亲水处理，本文分析了亲水处理之微观机理。
- Silicon wafer direct bonding technology 硅片直接键合技术
- Direct Bonding of Silicon Wafers 硅片的直接键合
- The paper discusses the selection of the resorcinolfree direct bonding system optimization for rubber to brass plated steel cord. 本文就橡胶与镀黄铜钢丝帘线无间苯二酚最佳直接粘合系统的选择加以评述。
- Akira Sugiyama,Yasunaga Nara.Improved direct bonding method of Nd:YVO4 and YVO4 laser crystals[J].Ceramics International 2005,31:1085. 李志刚;熊政军;黄维玲等.;高功率激光二极管端面抽运复合晶体激光器的研究[J]
- Conclusion: The curative effect of the light-cure veneer bonding group was obviously better than the direct bonding group. 结论氟斑牙光固化贴面粘结托槽组的疗效明显好于氟斑牙直接粘结托槽组。
- In this paper,the possibility of copper direct bonding to aluminum nitride substrate is studied,and the bonding mechanism is investigated by means of SEM and EDX. 研究了铜与氮化铝陶瓷直接键合的可行性,运用扫描电镜(SEM)、电子能谱(EDX)对键合机理作了一定的分析和探讨。
- Study on the Micro-Kinetics of Silicon Wafer Direct Bonding 硅片直接键合的微观动力学研究
- The direct bonding joint between cemented carbide and nodular cast iron and the indirect bonding joint by using nickel foil as intermediate layer were obtained by HIP diffusion bonding process. 用热等静压扩散连接法获得了硬质合金与球墨铸铁的直接连接接头和以镍箔为中间夹层的间接连接接头。
- J.Mizuno, T.Harada and T.Glinsner,“Fabrications of micro-channel device by hot emboss and direct bonding of PMMA”, Proceedings of Nano and Smart Systems International Conference, pp.24-27, 2004. 陈建人;微机电系统技术与应用;行政院国家科学委员会精密仪器发展中心出版;民国92年7月.
- The silicon chips are less than a millimeter thick. 这些矽片厚度不足一毫米。
- It is totally biocompatible and can form a direct bond with the neighbouring bone.In this paper,the characteristics,preparation and development of pore hydroxyapatite bioceramic are re-viewed. 本文在综合大量国内外文献的基础上，阐述了多孔羟基磷灰石生物陶瓷的性质、研究和发展。
