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- semiconductor chip bonding 半导体晶片焊接
- DRAM is a semiconductor chip used in most electronic products such as personal computers. 动态随机存取记忆体是应用于电子产品的半导体晶片，如个人电脑等。
- High viscosity, thixotropic paste for wire tacking, chip bonding and coil terminating. 高粘性,触变膏体,用于导线定位、片结合、线圈终端。
- A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. 一种芯片倒装型半导体器件，其配备的半导体芯片的表面上有多个焊盘电极。
- The Principle of QPSK is introduced, Vector figure of QPSK and Logic coding table are given, parameters of semiconductor chip TDA8050A of PHILIPS company are described mainly. 介绍QPSK原理 ,给出QPSK矢量图和逻辑编码表 ,重点概述PHILIPS公司半导体芯片TDA80 5 0A的参数
- The manufacturing step theat packages a semiconductor chip so it is protected and can be connected to other electronic components in electronic equipment. 被保护并且可能连接的片其他电子在电子设备里的零部件。
- The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface. 采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。
- In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM. 另外，由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着MCM中倒装焊接技术的普及应用，本文还对三种支撑技术进行了研究。
- This paper describes the internal cir-cuit of the DIP-CIB module,semiconductor chip technologies,package technologies and general purpose inverter design by using HVIC and the DIP-CIB module. 在此详细介绍了DIP-CIB模块的内部电路、半导体硅片技术、封装技术,以及如何配合专用的HVIC来实现通用变频器的小型化设计。
- The type of packages and the methods in which it is possible to mount the finished semiconductor chip(depending on factors such as heat dissipation, size, etc.Packages canbe plastic, ceramic, Cer - DIP, or other type. 封装的类型和方法（它们取决于热耗散和尺寸大小等因素），用此种方式即可安置经过精制的半导体芯片。封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。
- The little old lady has been replaced by fiber cable and semiconductor chips. 今天，媒婆的角色已被光缆与半导体芯片取代。
- The type of packages and the methods in which it is possible to mount the finished semiconductor chip(depending on factors such as heat dissipation, size, etc.). Packages canbe plastic, ceramic, Cer-DIP, or other type. 封装的类型和方法（它们取决于热耗散和尺寸大小等因素），用此种方式即可安置经过精制的半导体芯片。封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。
- Founded in 1967, Applied Materials creates and commercializes the nanomanufacturing technology that helps produce virtually every semiconductor chip and flat panel displays in the world. 自1967年成立至今四十年来，应用材料公司一直都是领导信息时代的先驱，以纳米制造技术打造世界上每一块半导体芯片和平板显示器。
- Surface Mounting and Chip Bonding Technology 表面组装与芯片键合混合工艺浅探
- MCM Flip Chip Bonding Technology Research MCM中倒装焊接技术研究
- These crystals are the basis of the semiconductor chips which run modern computers. 现代计算机里使用的半导体芯片都少不了这种结晶体。
- He is a great guy, a chip off the old block. 他是一位好人，就像他父亲一样。
- London: world sand prices skyrocket after North Korea announces plans to mass produce giant semiconductor chips. 伦敦：在朝鲜宣布大规模生产巨型半导体晶片之后，全球黄沙价格一路飙升。
- Formation of circle band interface of thermosonic flip chip bonding 热超声倒装键合环状界面的形成
- The film material is mainly applied in the fields such as surface technologies of microflow devices, biological chips and semiconductor chips, etc. 该薄膜材料主要应用于微流器件、生物芯片、半导体芯片表面技术等领域。
