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- profile of ground surface 地面纵断 面
- Perturbation of ground surface temperature reconstructions by groundwater flow? 用地下水流进行地面温度重建的扰动?
- The friction coefficient of the polish surface was 74% of that of grind surface. 摩擦表面抛光处理,使摩擦因数降低为磨削处理时的74%25。
- It can be seen that: during the single train runtime, settlement of ground surface is larger, and fluctuated. 结果表明：在单次列车运行期间内，地面的沉降较大，并且呈现波动现象；
- I turned my head and saw the profile of a man. 我转过头，看见了一个人的侧影。
- The laws of ground surface subsidence and rockmass movement in east area of Chenchao iron mine due to underground mining are studied. 东区现有地表下沉属于不连续下沉,岩层破坏主要是缓慢型破坏。
- The values of the experiment and the calculation of ground surface roughness are accordant basically and also have the same change tendency. 实验和计算结果基本吻合，并具有相同的变化趋势。
- The profile of variable curvature of grinding wheel is trued up by circle's implement (Fig.1). 新磨法利用园弧修正器修出变曲率的砂轮曲线。
- And we analyze the effects of different types of ground surface (pool, grassplot, mud, concrete plastic) upon thermal environment. 并分析了校园内不同下垫面(水体、草地、泥地、混凝土、地砖和塑胶地面)对热环境的影响。
- The BBC are working on a profile of the British nuclear industry. 英国广播公司正在报道英国核工业概况。
- The deformation of ground surface during the construction of curved pipe-jacking is studied with 3D finite element methods. 摘要通过建立三维有限元模型，研究了曲线顶管施工过程中地表的变形规律。
- The special materials used for this RBS system guarantee durability and efficiency in all atmospheric conditions, with every type of ground surface and at all temperatures. 由于采用特殊材料，所以可以保证了在任何条件下RBS系统的耐用与高效。）
- The expedition covered a lot of ground. 探险队到过很多地方。
- Our soldiers disputed every inch of ground. 我方战士寸土必争。
- The beam bends to a circular profile of radius R. 梁弯曲成半径为R的园形形状。
- The newspaper publishes a profile of a leading sportsman every week. 该报每周刊登一篇关於一个优秀运动员的简介。
- The soldiers contested every inch of ground. 士兵们为争夺每一寸土地而斗争。
- I turned my head ,and saw the profile of a man . 我转过头去，看见了一个男人的侧影。
- I turned my head,and saw the profile of a man. 我转过头去,看见了一个男人的侧影。
- According to the theoretical results, the rotating speed ratio of the wafer to the diamond millstone influences the track type of grinding surface. 另外可从理论模拟的结果得知，晶圆转速和磨盘转速两者的转速比会影响晶圆表面上的研磨轨迹型态。
