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- physico chemical mechanics 物理化学力学
- The physico chemical properties and rheology of gum black wattle was studied. 研究了黑荆胶的物理、化学性质及流变性质。
- Its physico chemical properties and spectrometry proved the compound was psoralidin. 理化性质和波谱分析证明该化合物为补骨脂里定。
- Physico chemical properties and fatty acid composition of Elsholtzia Ciliata (Thunb.) Hyland seed oil were analyzed by GC. 为开发利用香薷籽资源,对香薷籽油物理化学性质和脂肪酸组成进行了分析测定。
- The physico chemical property of MLC 500 catalyst can also be adjustable for different feedstocks to achieve ideal product slates. 因此，对不同性质的原料油，可有效地调整MLC-500的物理化学性质，获得理想的产品分布。
- Both the PFU method and physico chemical analysis indicated that mine wastewater could be effectively purified b y the constructed wetland. 其中生物多样性指数更能有效地评价水体质量。
- Chemical mechanism of exotic weed invasion. 外来杂草入侵的化学机制
- Compared with general UPE, the physico chemical performance of the product was good at resistance to acid alkali , heat resistant , mechanical properties, etc. 结果表明，用环氧环己烷合成的树脂具有良好的耐酸、耐碱、耐热性能和较好的机械性能。
- The weathering of soft rock was systimatically analyzed through measuring its microsturcture, microporosity, macrofissure, and the physico chemical properties. 通过对软岩风化前后微结构、微孔隙及宏观裂隙和宏观物理力学参数的测试对比，系统地研究了软岩风化的微观和宏观效应。
- Ther are small heat stable peptides, large heat labile proteins, and lantibiotics.Their physico chemical nature, genetic behavior and application are reviewed. 细菌素可分为热稳定的小分子肽、热敏感的大分子蛋白和羊毛硫抗生素三类。
- The research progress of tribochemistry in the aspects of chemical effects of rubbing surfaces, physico chemical changes under dry and lubricated friction conditions were reviewed. 介绍了摩擦化学在材料制备中的应用及摩擦化学的研究方法；
- physico chemical absorbing ability 物理化学吸收能力
- Chemical Mechanical Polishing (CMP) is the most effective way to achieve global planarization in semiconductor process. 化学机械抛光，是半导体制程中达到全域平坦化最有效的办法，同时也是众多制程中不可或缺的重要制程步骤。
- Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. 摘要:化学机械抛光是现在半导体产业中最常被使用的平坦化制程。
- Bachelor degree in Mechanical engineer or equivalent, preferred education background in Welding, Chemical Mechanical, NDT, Power Equipments, etc. 本科以上学历,机械背景,焊接,化工机械,无损检测,动力设备专业优先。
- The effect on IHT and appliance in training physiological and biologic chemical mechanism has been summarized, in order to apply on training further in the future. 摘要从间歇性低氧训练的产生及其在运动训练中的应用和生理、生化机制等方面进行综述，旨在促进间歇性低氧训练在运动训练中进一步应用。
- The main chemical mechanism of the adsorption was the formation of double hydrogen bands between AFB_1 and montmorillonite or modified montmorillonite. 说明蒙脱石和改性蒙脱石对AFB_1存在化学吸附，其选择性吸附机制可能主要是由于它们边缘的羟基与AFB_1之间形成了双氢键。
- Diamond disk conditioners have long served the semiconductor chemical mechanical polishing (CMP) process for polish pad dressing. 摘要钻石修整器应用于化学机械抛光中抛光垫的修整，已有很长的一段时间。
- Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. 化学机械抛光，是目前半导体制程中达全域平坦化最有效的方式，同时也是许多制程中不可缺少的步骤。
- Boning, D., W. Moyne and T. Smith, “Run by Run Control of Chemical Mechanical Polishing,” IEEE Trans. CPMT (C), 19, 307-314 (1996). 周育乐，考虑制程使用时间之批次控制方法，台湾大学工业工程研究所硕士论文，台北，台湾(2000)。
