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- non--silicon surface micromachining 非硅表面微加工
- PAN G CH T , L UO S B. Advanced asp heric surface machining technology[J ]. 庞长涛;罗松保.;非球面加工先进技术[J]
- Results This method may form a homogeneous macromolecule self-a ssembled monolayer on silicon surface. 结果该方法可以在功能化的硅表面形成结构均一的高分子自组装膜。
- The relation between chelating quantities and silicon surface morphology was researched. 结果表明:硅基片的表面形貌对蛋白质的吸附行为有很大影响。
- The results indicate that the silicon surface could be overwhelmingly terminated with hydrogen rather than fluorine in the HF based solutio... 实验结果表明,在以HF为主的湿法刻蚀中,硅表面的悬挂键主要被H而不是被F取代。
- Herein, nanometer multilayer copper/cobalt film was prepared on monocrystalline silicon surface by electrodeposition under double pulsed potential. 采用双脉冲控电位技术在单晶硅上沉积铜/钴纳米多层膜。
- Silicon CMOS grew into the ULSI world we occupy today largely because of the native oxide that grows readily on every silicon surface. 摩尔定律表述了MOS晶体管线宽步进与大小，功耗和性能的关系。
- The feasibility of using protein A to immobilize antibody on the silicon surface of the imaging ellipsometry biosensor was investigated in this study. 研究了在硅片表面上通过A蛋白定向固定抗体分子用于椭偏光学生物传感器免疫检测的可能性。
- A new semi-automatic spherical surface machining device is presented. Its structure and working principle are involved. 介绍一种在车床上使用的半自动车削球面装置的结构和工作原理。
- In this dissertation, a Twyman-Green interferometer is used to measure silicon surface deformation after anodic bonding. 本文还采用基于相移干涉的泰曼-格林干涉测试系统对键合后硅片的形貌进行了测量。
- The line of intersection, inward concave and shallow area of curved surface are the difficult points in curved surface machining. 曲面交线、曲面内凹区域及曲面中浅平面的加工是曲面加工中的难点。
- First of all, 1-Hexadecene self-assembled monolayers was fabricated on hydrogen-terminated silicon surface by traditional way and was checked by XPS and Raman spectrum technology. 首先采用传统自组装方法在氢终止的硅表面上制备了十六烯自组装分子膜,并利用X射线光电子能谱和拉曼光谱技术对自组装膜进行了检测。
- Quantum discussion combined with XPS data shows that the N-vinylcarbazole was really reacted with silicon surface through carbon-carbon double bond broken. 2. 表征结果表明，有机分子通过Si-N键以共价键键合的方式连接到了硅表面上，这证明了利用Si-Cl与NH/NH2官能团将有机分子修饰到硅表面这一方法是简单有效的，而且形成的有机分子膜较致密和稳定。
- An algorithm on tool-path generation, optimized through the use ofhelix-blend-Zigzag method and NURBS advantage, is put forward for HSM complex3-D surface machining. 结合 NURBS 的曲线优势,提出并实现了面向复杂曲面的 3 轴联动高速铣精加工可变行距的螺旋线与 Zigzag 混合刀轨优化算法。
- Due to band bending of semiconductor surface applied electric field, the electric emission on silicon surface can be considered as a tunneling process through a potential well. 摘要硅作为场发射阴极成为可能，硅的场发射研究又重新引起人们的重视。
- This proposed system has been dev eloped and used by author in a CAD system , and it is shown to be robust and eff icient for sculptured surface machining. 该系统已经应用到作者开发的CAD系统并在几种复杂表面零件的生产中使用,明显减少了刀具路径生成时间,提高了加工效率。
- This paper analyzes the correspondent factors which affects surface machining quality and puts forward the measures for improving spark erosion accuracy and surface quality. 分析了影响电火花加工工件表面质量的相关因素,提出了改善电火花加工工件精度和表面质量的措施。
- G. B. Vickers and K. W. Guan (1989), “Ball-Mills Versus End-Mills for Curved Surface Machining,” ASME Journal of Engineering for Industry, Vol. 111, pp. 22-26. 黄炜能(2006)，含分离叶片离心式涡轮之整合性刀具路径规划架构，硕士论文，清华大学工业工程与工程管理研究所。
- Desorption/ionization on porous silicon surface (DIOS) is a novel matrix free method for the analysis of small molecule, which overcomes the limitation of matrix assisted laser desorption/ionization in low molecule analysis. 多孔硅表面的解吸离子化质谱是一种新的生物质谱分析方法。 克服了MALDI TOF MS中的基体干扰 ,适合进行小分子分析。
- This non sequitur invalidates his argument. 他不根据前提推理因而论证无效。
