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- CdS nanocrystals capped with bis(2 ethylhexyl) sulfosuccinate disodium(AOT) molecular and Au nanocrystals were co deposited on a n type silicon wafer to study the different polarizabilities induced by a conductive tip. 将AOT(bis( 2 ethylhexyl)sulfosuccinatedisodium)分子包覆的CdS纳米晶和Au纳米晶共同沉积在n型硅片表面 ,以分析导电探针对其诱导极化。
- Multiplayer ferroelectric thin films BIT/PZT/BIT,PZT/BIT and BIT were deposited on (100) p?type silicon wafers by pulsed excimer laser. ?I?V? loop and ?P?V? loop were obtained. 利用准分子激光原位淀积方法制备了BIT/PZT/BIT,PZT/BIT和BIT层状铁电薄膜,获得了电流密度-电压(I-V)回线和极化强度P-V电滞回线。
- N type and P type 4＂-6＂silicon epitaxial wafers. 4＂-6＂N型和P型各类硅外延片。
- Hot plate with silicon wafer lowered to heating position. 加热板与矽晶圆降低至加热位置。
- Mechanical Test Wafer - A silicon wafer used for testing purposes. 机械测试晶圆片-用于测试的晶圆片。
- Both transistors are not of the n. p. n type. 两个晶体管不都是n.;p
- Contamination Particulate - Particles found on the surface of a silicon wafer. 沾污颗粒-晶圆片表面上的颗粒。
- And draws a conclusion that doped N type monocrystal silicon is quite fit for micro EDM, while a non doped one isn't by a lot of EDM experiments. 对未掺杂单晶硅和掺杂N型硅进行了电火花加工工艺试验,得出了掺杂N型硅有很好的微细电火花加工性能的结论。
- Hot plate with silicon wafer in initial configuration (before heating). 加热板与矽晶圆在启始状态(加热前)。
- SiO2, an insulator, can be formed by oxidation of surface of the silicon wafer. 经净化的晶棒接著用机械方法切成薄片.;这些切片就叫做晶圆
- In this paper,intrinsic silicon epitaxial layers were grown on N type(As doped) substrate by UHV/CVD,which were then characterized using SPR,AFM and DCXRD methods. 文章利用自行研制的超高真空化学气相淀积(UHV/CVD)系统SGE500,在N型(掺As)重掺杂衬底上进行了薄本征硅外延层生长规律的研究; 并采用扩展电阻(SPR)、原子力显微镜(AFM)、双晶衍射(DCXRD)等方法,对外延层的质量进行了评价。
- A New Method of Resistless Photochemical Etching for Silicon Wafer[J]. 引用该论文 杨杰;刘焰发;村原正隆.
- Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer. 沾污区域-部分晶圆片区域被颗粒沾污,造成不利特性影响。
- ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer. 光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。
- Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component. 芯片:单回路或元件的硅晶元,无引脚的电子元件。
- Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes. 测试晶圆片-用于生产中监测和测试的晶圆片。
- Pot door is sealed up with gasing type silicon rubber , is sealed and reliable , the length of service life is changed per 3 years one time. 锅门采用充气式硅橡胶密封，密封可靠，使用寿命长，每三年更换一次。
- The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically. 对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。
- Conclusion Abnormal changes of apo(s) i n type 2 dia betes mellitus may be a cause of type 2 diabetes associated with HTG and CHD. 结论载脂蛋白异常是2型糖尿病患者的代谢紊乱特征，同时可能是2型糖尿病发生脂代谢紊乱和冠心病的重要原因。
- A silicon wafer with micro channels and a pyrex glass with hot films have been bonded to form this sensor. 采用硅微加工技术制作微管道,在玻璃上通过溅射方法形成钛铂合金热膜,最后将两者键合封装,形成埋置了热膜的封闭微管道。
