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- Multichip module technology(MCM) is the optimal way of providing circuit system miniaturization. 多芯片组件技术（MCM）促使电路系统小型化过渡的最好形式。
- MCM (MultiChip Module) is a special type of package that can hold several integrated circuits. 因为是半双工;所以一次只能一边传资料出去.
- For more complicated animal models, U.S.C. physicist Armand Tanguay suggests a multichip module to facilitate the transition. 而对更复杂的动物模型，南加州大学物理学者唐归则提议以多晶片模组来协助转换。
- Chapter 5 discusses the design and test of S-band multichip module (MCM) 4-bit digital phase shifter and switch section ,including five sections. 第五章论述S波段四位MCM数字移相器开关组件的设计和测试，包括五部分内容。
- This dissertation is mainly on the research of S-band multichip module (MCM) 4-bit digital phase shifter and switch section. 本论文主要是对S波段MCM四位数字移相器开关组件进行研究。
- This paper describes the features of LTCC three dimension Multichip module technology, and analyzes the development trend of LTCC 3D-MCM. 本文概述了低温共烧陶瓷(LTCC)三维多芯片组件技术的特点,并分析LTCC 3D-MCM 的发展趋势。
- Analog Devices has over 30 years of design and manufacturing experience of MultiChip modules (MCMs). ADI公司有30多年设计和制造多芯片模块(MCM)的经验。
- A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules (MCMs). 本文提出了一种用于求解高速VLSI和多芯片组件(MCM)中有耗互连线瞬态响应的稳定递归算法。
- Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则
- FEA Method in the Thermal Performance of Multichip Module 有限元热分析法在大功率多芯片组件中的应用
- This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems. 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
- Packaging Technology for Multichip Module Using New Type Multilayer Substrate 采用新型多层基板的多芯片组件封装技术
- Application of ANSYS-Finite Element Analysis Software to Thermal Analysis of Multichip Module 有限元分析软件ANSYS在多芯片组件热分析中的应用
- Three Dimensional Finite Element Analysis of Heat Dissipation of Multichip Module 多芯片组件散热的三维有限元分析
- 3-D Multichip Module (MCM) is the developing trend of microelectronic packaging in the future. 3 -D多芯片组件 (MCM)是未来微电子封装的发展趋势。
- Object repository support for creating shared, reusable form and data module. 用于创建共享、可重用窗体和数据模块的对象储存库支持。
- A young Air Force officer served as lunar module pilot for Apollo 16. 一位年轻的空军军官担任了阿波罗16号登月舱的驾驶员。
- Analysis of electromagnetic interference spectrum in multichip modules 多芯片组件电磁干扰频谱中的两次峰值问题研究
- Replace module and reassemble valve. 更换模块并重新组装阀门。
- Note: Check the LED on the module. 注意：检查模块上的led指示灯。
