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- multichip hybris [计] 多片微电中
- MultiChip Products can offer MCM solutions at a lower cost then designing and building your own discrete solution. 多芯片产品以较低的成本提供MCM解决方案,然后设计和构建用户自己的分立解决方案。
- Analog Devices has over 30 years of design and manufacturing experience of MultiChip modules (MCMs). ADI公司有30多年设计和制造多芯片模块(MCM)的经验。
- Multichip module technology(MCM) is the optimal way of providing circuit system miniaturization. 多芯片组件技术（MCM）促使电路系统小型化过渡的最好形式。
- Hydrochloric acid music multichip of shape, is after can you using dextrose dilute, inject used? 盐酸曲吗多片状的，可以用葡萄糖稀释之后注射用么？
- MCM (MultiChip Module) is a special type of package that can hold several integrated circuits. 因为是半双工;所以一次只能一边传资料出去.
- MultiChip Products leverage Analog Devices silicon into a single package, providing a robust, cost effective and space saving solutions. 多芯片产品将ADI公司的半导体技术引入一个单独的封装,从而提供一种鲁棒性、经济有效和节省空间的解决方案。
- For more complicated animal models, U.S.C. physicist Armand Tanguay suggests a multichip module to facilitate the transition. 而对更复杂的动物模型，南加州大学物理学者唐归则提议以多晶片模组来协助转换。
- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
- Because the FT232 chips come with a unique serial number, you can identify the correct device within a multichip environment. 由于FT232芯片出场有一个自己的唯一的序号,你就可以在一个多芯片模块的环境下找出正确的设备。
- Chapter 5 discusses the design and test of S-band multichip module (MCM) 4-bit digital phase shifter and switch section ,including five sections. 第五章论述S波段四位MCM数字移相器开关组件的设计和测试，包括五部分内容。
- This dissertation is mainly on the research of S-band multichip module (MCM) 4-bit digital phase shifter and switch section. 本论文主要是对S波段MCM四位数字移相器开关组件进行研究。
- A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichip modules (MCMs). 本文提出了一种用于求解高速VLSI和多芯片组件(MCM)中有耗互连线瞬态响应的稳定递归算法。
- This paper describes the features of LTCC three dimension Multichip module technology, and analyzes the development trend of LTCC 3D-MCM. 本文概述了低温共烧陶瓷(LTCC)三维多芯片组件技术的特点,并分析LTCC 3D-MCM 的发展趋势。
- A double-sides layout, six layers laminated multichip model with full metal package ispresented for a 500MHz mix-signal microsystem integration. The transmission line is simulated bySpecctraQuest . 提出了一种全金属管壳封装、双面布局/六层布线的叠层多芯片组件微系统结构, 以实现500MHz高速数模混合微系统集成,并借助SpecctraQuest软件仿真了基板上关键互连线的传输特性。
- This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems. 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
- Compositive floor calls joining together the floor again, by width equal small floor joining together rises, again by multichip point to accept capable person transverse joining together. 集成地板又称拼接地板，由宽度相等小块地板拼接起来，再由多片指接材横向拼接。
- MCP(multichip component packages) 多芯片封装
- High-Density Multichip Interconnect 高密度多芯片互连
- Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则
