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- TIANJIN SHUANGLU ELECTRONICS PACKAGING MATERIAL CO., LTD. 天津市双鹿电子元件包装材料有限责任公司。
- IAM GmbH is a company operating within many ranges and offers Development projects, Micro electronics as well as Research projects. 是一家诚信的、高效能的生产商和服务商，该公司提供新型的、专门的产品，例如科研项目,技术转化、技术引进。
- Raytheon will furnish systems engineering, information assurance, maritime C4I hardware and electronics packaging, and integrated logistics support. 雷声公司将提供系统工程、信息担保、海上C4I硬件和电子包，以及综合后勤支撑。
- A fabricating technology for high energy density micro electromagnetic actuator based on Micro Electron Mechanics System(MEMS) is introduced. 提出了制作高能量密度电磁驱动器的工艺方法。
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- FM2822 is a dimmable electronic ballast ASIC of SHANGHAI FUDAN Micro electronics Corporation. FM2822是上海复旦微电子公司推出的一款可调光电子镇流器ASIC。
- Ellis, K.P., Vittes, F.J., and Kobza, J.E., “Optimizing the performance of a surface mount placement machine,” IEEE Transactions on Electronics Packaging Manufacturing, Vol.24, No.3, pp160-70, 2001. 张朕豪，以遗传演算法求解转塔式插件机的元件插置排序问题和料带储位安排问题，台湾大学工业工程学研究所，硕士论文，民国93年。
- The conference will feature short courses, conference keynotes, special forums and technical sessions to cover the technological developments in all the areas of electronics packaging. 会议将通过专题讲座、特邀报告、主题论坛、分会报告、论文张贴等形式对电子封装的各个技术领域中的最新进展进行交流。
- The Fuzhou auspicious core micro electron limited company is aspecialized integrated circuit design company, and recognizes in2005 after the national examination and approval for the integrated circuitdesign enterprise. [项目概况]福州瑞芯微电子有限公司是一家专业的集成电路设计公司，并于2005年经国家审批认定为集成电路设计企业。
- Waxes for Electron Wafer Binding: Waxes for Electron Wafer Binding,mainly used in precision process of micro electron wafer (U piece,S piece or SMD piece),excellent strong adhesive ability,no scathe to element ,cleanup easily after process. 电子晶片粘接蜡系列：主要用于微电子硅片或石英晶片（U片、S片或SMD片）的精密加工，具有极强的附着力，对元件无任何损伤，使用后易去除。
- Jerry's first electronics package was the size of a small refrigerator. 杰里的第一个电子包有一个小型电冰箱那么大。
- Electronic manufacturing consistof semiconductor manufactruing, electronic packaging and assembling. 电子制造包括半导体制造和电子封装与组装。
- The CPC electronic packaging materials have the best integrated properties when annealed under the temperat. 研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
- Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year. 由中国电子学会生产技术学分会(CEPS)主办的电子封装技术国际会议(ICEPT)将迎来第十届庆典。
- A new experimental technique on the CTE measurement of metal composite leads in electronic packaging using laser speckle interferometry was presented. 在相对简单的实验设备下,得到较高精度金属复合引线的热膨胀系数值。
- micro electron mechanical systems (MEMS) 微机电系统
- This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering. 这个版本还包括涵盖新课题，如纳米技术，微机电系统，电子封装，全球气候变化，电动和混合动力汽车，生物工程。
- The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在电子元件的设计和电子封装的可靠性评估中焊点的热-机械可靠性是一个关键的因素。
- It describes the current situation of electronic packaging industry, analyzes the waste in its inner management, shows the detail steps of using 5S activity in the test workshop. 摘要从电子封装企业的生产现状出发，针对企业内部管理存在的问题，提出在测试车间推行"5S"管理活动的具体实施步骤。
- Our HPI TX-2 radio, receiver and servos provide a reliable and trustworthy electronics package. 我们于1946德克萨斯州- 2收音机，接收器和伺服提供一个可靠的和可信赖的电子封装。
