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- material removal simulation 材料去除仿真
- The experimental results agree well with the simulation predictions, which reveals the regularities of material removal and verifies the theoretical model ... 仿真和试验结果揭示了抛光表面去除的规律,验证了表面去除廓形的理论模型。
- Scraps or material removed when something is trimmed. 剪削，废料从被修剪的东西上掉下来的碎屑
- Floationg material removal of semi clean water and sewage, waste, dirty water. 用于去除生活用下水,废水,污水中的浮游物质。
- The material removal volume of wear-resisting cast steel,when ground with the electroplated CBN tools made with ... 在电镀过程中,应严格控制CBN活化表面钯质点的数量,使其保持在合适范围内,避免CBN颗粒相互粘结和成块现象。
- The result indicated that the material removal rate of isopulse generator is over 20% higher than that of general pulse generator. 实验结果表明，与普通脉冲电源相比,等能量脉冲电源可以提高加工效率20%25以上。
- The dominant material removal mechanisms in grinding of PCD are abrasive wear, fragmentation, thermal-physics and thermal-chemical process. PCD材料去除主要是通过磨粒的机械磨耗、破碎作用和热物理、热化学作用等方式。
- This paper proposed a viewpoint to explain why vibration assistance may increase material removal rate (MRR) in vibration-assisted finishing process. 摘要讨论振动研磨加工过程中通过辅助振动提高材料去除率的原因。
- Experiment results showed that WEDM in atmosphere offers advantages such as better straightness,shorter gap length and higher material removal rate. 实验结果表明,气中加工的直线度好、放电间隙窄、加工速度(材料去除率)高。
- Experiment results showed that WEDM in atmosphere offers advantages such as better straightness and higher material removal rate. 实验结果表明,气中线切割加工具有加工表面直线度好、加工速度(材料去除率)高等优点。
- Thus, it is concluded that the collision and shearing actions caused by the radial flowing of slurry play a dominant role in material removal in FJP. 该现象说明，抛光液中磨料粒子的径向流动对工件产生的径向剪切应力是材料去除的关键。
- Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates. 硬盘盘基片粗抛光必须在较高材料去除率的基础上获得高表面质量。
- Larger diamond crystals and greater diamond protrusion will result in a potentially faster material removal rate when there is enough horsepower available. 金刚石晶体和金刚石突较大将导致更大更快的物质可能有足够的去除率马力刊物。
- Material removal by machining involves interaction of five elements: the cutting tool, the toolholding and guiding device, the workholder, the workpiece, and the machine. 材料的切削与5个因素有关：刀具，刀具的夹具和导向装置，工件的夹具，工件和加工机器。
- The effect of compositions,select of adhesive,particle size of MAP on the material removal and surface roughness of stainless steel 1Cr18Ni9Ti have been studied. 研究磁性磨料的配比、粘结剂的选择以及粒度对不锈钢管 1Cr18Ni9Ti的材料去除量和表面粗糙度的影响。
- As a rule, if material removal exceeds 0.0015 in (or 10 percent of the Almen strip intensity), the surface should then be shot-peened to CMM requirements. 大修中喷丸层的恢复相当重要，确保喷丸压缩层的剩余应力大修或应力恢复。
- The material removal models of two-body lapping, three-body polishing and abrasive jet machining were established based on the machining mechanism and the numb... 利用平面磨床进行了磨粒喷射精密光整加工实验,实验结果验证了依据机理所建立的材料去除模型,且实验结果和模型吻合很好。
- With the optimized normal rake angle, machining force and temperature change less, but material removal rate is improved obviously with increasing cutting speed. 通过优化刀具前角，提高切削速度，切削力和切削温度变化较小，但是显著提高了材料去除率。
- Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized. 通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
- The polishing pad is main consumables of the CMP system, the structure and surface roughness of pad have great effects on the material removal rate and surface roughness of wafer. 抛光垫是化学机械抛光(CMP)系统中的主要耗材之一，抛光垫的结构和表面粗糙度对CMP过程中的硅片材料去除率和表面粗糙度有很大影响。
