您要查找的是不是：
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。
- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引线框架材料的主要性能为：抗拉强度在600MPa以上，显微硬度大于180HV，导电率大于80%25IACS。
- Application and Commercialization of Copper Alloy Lead Frame Materials for Integrated Circuits 集成电路用铜合金引线框架材料的应用及产业化
- Standard Specification for Integrated Circuit Lead Frame Material 集成电路引线框材料
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- What frame materials do you like? 您喜欢什么材料的眼镜架?
- lead frame materials 引线框架材料
- Development and Expectation of Copper-based Lead Frame Material Used in Intergrated Circuit 集成电路用铜基引线框架材料的发展与展望
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- The Study of Horizontal Continuous Casting Technology for Lead Frame Material KFC 引线框架材料KFC水平连铸工艺研究
- lead frame material 引线框材料
- Polypropylene is chemically inert and compatible with all window frame materials. 聚丙稀是一中不活泼的化学原料，所以能和所有的金属窗框架很好的配合在一起。
- Frame Materials: Steel tubing for the stays and a Steel Bedpost with back half of a ski inserted. 框架材料：钢管材为保持和钢Bedpost背部有一半的滑雪字。
- Be involved in part development in non-metal materials, like shader and LED frame housing etc. 参与非金属材料零部件的开发，如遮光罩、模块等。
- Frame Materials: 20" steel kid bike and a donor bike's BB and downtube, the seat is plywood on old Futon slats. 框架材料： 20 “钢铁孩子的自行车和自行车的捐助者的BB和downtube ，所在地是胶合板旧被子缝。
- Frame Materials: 20" steel kid bike (six speed w/ rear shock) and a donor bike's BB and a steel backbone. 框架材料： 20 “钢铁孩子骑自行车（六高速瓦特/后方休克）和捐助自行车的BB和钢铁骨干。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
