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- The application of PCI Express(interconnect technology for next generation) in embedded system. (下一代内部互联技术)在嵌入式系统中的应用。
- The copper interconnect technology for ICs and their applications are introduced briefly. 简要介绍了集成电路铜连线技术及其应用.
- Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒装芯片是一种性能价格比良好的互连技术 ,要求采用富有创新的操作 ,以满足KGD的测试方法和操作工艺的需要。
- Ceramic Interconnect Technology: The Next Generation. International Conference And Exhibition. 2nd 2004. (CD-ROM) Held 26-28 April 2004, Denver, Colorado. 2004年第2届陶瓷封接技术：第二代国际会议与展览会文集.;（光盘），2004
- The traditional Al metallization could not meet the requirements for the development of interconnect technology. Developing damascene Cu metallization has become the main trend recently for the interconnect technology. 传统的Al金属互连技术已经不能满足现代互连技术发展的需要 ,大马士革结构的Cu金属互连技术已成为互连技术的重点发展方向之一。
- High Bandwidth Differential Interconnect Technology 高带宽微分互连技术
- electricity interconnect technology 电气互联技术
- Cots Optic Interconnect Technology Application in Aerospace 现有光学互连技术与航空航天应用
- The Interconnection technology based on embedded parallel processing system adopts processors like DSP,FPGA,GPP/RISC,ASIC,ASSP and MCU. 基于嵌入式并行处理系统的互联技术,采用DSP、FPGA、GPP/RISC、ASIC、ASSP、MCU等处理器。
- HDIT High Bandwidth Differential Interconnect Technology 高带宽微分互连技术
- It's strange how people's lives interconnect. 人们的生活是如何互相联系在一起的，真是不可思议。
- Physical shared memory bus, message translating LAN and copy shared memory network are the main interconnecting technology using in distributed real-time simulation. 分布式仿真系统可采用的联接方式主要有物理共享内存总线、消息传递网络和复制共享内存网络三种。
- In the Al interconnection technology, the metal line is formed by the etching process, but copper's chloride is nonvolatile, so it can't implement etch process. 在铝工艺中，金属布线是通过刻蚀形成的，而铜的氯化物是不挥发的，因此无法应用刻蚀工艺。
- Technology is a booming sector of the economy. 技术是一个迅速发展的经济部门。
- Flip-chip interconnect technology in optoelectronics device packaging 倒装芯片互连技术在光电子器件封装中的应用
- Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density. 摘要低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
- Study on Electricity Interconnect Technology of City Railcar Electric 城轨电器电气互联技术研究
- The compact disc is a miracle of modern technology. 激光唱片是当代技术的奇葩。
- Tried to interconnect the two theories. 试图融汇贯通这两个理论
- The science and technology of space flight. 航天学，宇宙航行学研究宇宙飞行的科学及技术
